Meng-Jung Lee

Person

Taoyuan County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Fan-out package having a main die and a dummy die
- Patent number 12,224,247
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layouts for conductive layers in integrated circuits
- Patent number 12,107,048
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yu Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package having a main die and a dummy die
- Patent number 11,967,563
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit check method and electronic apparatus
- Patent number 11,959,956
- Issue date Apr 16, 2024
- Realtek Semiconductor Corp.
- Yun-Jing Lin
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package with redistribution structure and manufacturi...
- Patent number 11,955,439
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Routing structure
- Patent number 11,929,331
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chin-Shen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film non-uniform stress evaluation
- Patent number 11,804,410
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-De Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector
- Patent number D998574
- Issue date Sep 12, 2023
- Jyh Eng Technology Co., Ltd.
- Yen-Lin Lin
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Systems and methods for integrated circuit layout
- Patent number 11,748,542
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Hsiung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Image sensor pixel and metal shielding of charge storage device of...
- Patent number 11,728,362
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Cheng-Yen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for analyzing electromigration (EM) in integrated circuit
- Patent number 11,657,199
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Shen Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Illumination apparatus capable of illuminating different lighting p...
- Patent number 11,638,380
- Issue date Apr 25, 2023
- Au Optronics Corporation
- Hsin-Hui Wu
Information Patent Grant
Layouts for conductive layers in integrated circuits
- Patent number 11,600,568
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yu Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internet of things system with prediction of farmland soil status a...
- Patent number 11,586,948
- Issue date Feb 21, 2023
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Wen-Liang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package with redistribution structure and manufacturi...
- Patent number 11,581,268
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Routing structure and method of forming the same
- Patent number 11,532,562
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chin-Shen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-socket panel device with anti-crosstalk structure
- Patent number 11,483,922
- Issue date Oct 25, 2022
- Jyh Eng Technology Co., Ltd.
- Yen-Lin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for analyzing electromigration (EM) in integrated circuit
- Patent number 11,455,448
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Shen Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system of planning fitness courses
- Patent number 11,413,501
- Issue date Aug 16, 2022
- J-MEX INC.
- Deng-Huei Hwang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method and system of planning fitness course parameters
- Patent number 11,338,174
- Issue date May 24, 2022
- J-MEX INC.
- Deng-Huei Hwang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor package including shielding plate in redistribution s...
- Patent number 11,195,802
- Issue date Dec 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Operating method for wearable device interacting with operated devi...
- Patent number 11,169,605
- Issue date Nov 9, 2021
- J-MEX INC.
- Chin-Ting Chu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fan-out package having a main die and a dummy die
- Patent number 11,094,641
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for preparing glycoprotein-drug conjugates
- Patent number 11,085,062
- Issue date Aug 10, 2021
- Development Center for Biotechnology
- Shih-Chong Tsai
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Electroluminescent device having color layers in patterned pixel de...
- Patent number 11,056,663
- Issue date Jul 6, 2021
- Au Optronics Corporation
- Hsin-Hui Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Routing design of dummy metal cap and redistribution line
- Patent number 11,031,352
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of detecting relations between pins of circuit and computer...
- Patent number 11,010,521
- Issue date May 18, 2021
- Realtek Semiconductor Corporation
- Chia-Ling Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated device and method of forming the same
- Patent number 10,977,415
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hiranmay Biswas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for analyzing electromigration (EM) in integrated circuit
- Patent number 10,963,609
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Shen Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Oral pH independent dosage formulation for treating neurodegenerati...
- Patent number 10,894,023
- Issue date Jan 19, 2021
- Center Laboratories, Inc.
- Meng-Ju Lee
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
LAYOUTS FOR CONDUCTIVE LAYERS IN INTEGRATED CIRCUITS
- Publication number 20240379552
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging of Dies Including TSVs using Sacrificial Carrier
- Publication number 20240339370
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufactoring Co., Ltd.
- Chien-Fu Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Having a Main Die and a Dummy Die
- Publication number 20240266298
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURI...
- Publication number 20240222291
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240178095
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR IMPROVING LIGHT SENSOR RESPONSE
- Publication number 20240079504
- Publication date Mar 7, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Meng-Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240071947
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED CIRCUIT LAYOUT
- Publication number 20240020451
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Hsiung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCON...
- Publication number 20230420413
- Publication date Dec 28, 2023
- Intel Corporation
- Alois Nitsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PIXEL AND METAL SHIELDING OF CHARGE STORAGE DEVICE OF...
- Publication number 20230335569
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIDEO CONFERENCE DEVICE AND VIDEO CONFERENCE SYSTEM
- Publication number 20230298299
- Publication date Sep 21, 2023
- HIMAX TECHNOLOGIES LIMITED
- Kuei-Hsiang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LAYOUTS FOR CONDUCTIVE LAYERS IN INTEGRATED CIRCUITS
- Publication number 20230154849
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURI...
- Publication number 20230154863
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTING STRUCTURE
- Publication number 20230121445
- Publication date Apr 20, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIN-SHEN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TESTING POWER LEAKAGE OF CIRCUIT AND PROCESSING SYSTEM U...
- Publication number 20230075145
- Publication date Mar 9, 2023
- Realtek Semiconductor Corp.
- Meng-Jung Lee
- G01 - MEASURING TESTING
Information Patent Application
LAYOUTS FOR CONDUCTIVE LAYERS IN INTEGRATED CIRCUITS
- Publication number 20220406716
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM NON-UNIFORM STRESS EVALUATION
- Publication number 20220359313
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-De HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ANALYZING ELECTROMIGRATION (EM) IN INTEGRATED CIRCUIT
- Publication number 20220358271
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Shen LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGE SENSOR PIXEL AND METAL SHIELDING OF CHARGE STORAGE DEVICE OF...
- Publication number 20220344397
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-SOCKET PANEL DEVICE WITH ANTI-CROSSTALK STRUCTURE
- Publication number 20220183139
- Publication date Jun 9, 2022
- JYH ENG TECHNOLOGY CO., LTD.
- Yen-Lin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURI...
- Publication number 20220093526
- Publication date Mar 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTING STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20210407913
- Publication date Dec 30, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIN-SHEN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Having a Main Die and a Dummy Die
- Publication number 20210375775
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED CIRCUIT LAYOUT
- Publication number 20210224456
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Hsiung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR ANALYZING ELECTROMIGRATION (EM) IN INTEGRATED CIRCUIT
- Publication number 20210209278
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Shen LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT CHECK METHOD AND ELECTRONIC APPARATUS
- Publication number 20210190844
- Publication date Jun 24, 2021
- Realtek Semiconductor Corp.
- Yun-Jing Lin
- G01 - MEASURING TESTING
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20210143131
- Publication date May 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210098391
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM NON-UNIFORM STRESS EVALUATION
- Publication number 20210066139
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-De HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ANALYZING ELECTROMIGRATION (EM) IN INTEGRATED CIRCUIT
- Publication number 20210042460
- Publication date Feb 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Shen LIN
- G06 - COMPUTING CALCULATING COUNTING

Meng-Jung Lee

Person

Patents Grantslast 30 patents

Fan-out package having a main die and a dummy die

Layouts for conductive layers in integrated circuits

Fan-out package having a main die and a dummy die

Circuit check method and electronic apparatus

Semiconductor package with redistribution structure and manufacturi...

Routing structure

Thin-film non-uniform stress evaluation

Electrical connector

Systems and methods for integrated circuit layout

Image sensor pixel and metal shielding of charge storage device of...

Method for analyzing electromigration (EM) in integrated circuit

Illumination apparatus capable of illuminating different lighting p...

Layouts for conductive layers in integrated circuits

Internet of things system with prediction of farmland soil status a...

Semiconductor package with redistribution structure and manufacturi...

Routing structure and method of forming the same

Multi-socket panel device with anti-crosstalk structure

Method for analyzing electromigration (EM) in integrated circuit

Method and system of planning fitness courses

Method and system of planning fitness course parameters

Semiconductor package including shielding plate in redistribution s...

Operating method for wearable device interacting with operated devi...

Fan-out package having a main die and a dummy die

Processes for preparing glycoprotein-drug conjugates

Electroluminescent device having color layers in patterned pixel de...

Routing design of dummy metal cap and redistribution line

Method of detecting relations between pins of circuit and computer...

Integrated device and method of forming the same

Method for analyzing electromigration (EM) in integrated circuit

Oral pH independent dosage formulation for treating neurodegenerati...

Patents Applicationslast 30 patents

LAYOUTS FOR CONDUCTIVE LAYERS IN INTEGRATED CIRCUITS

Packaging of Dies Including TSVs using Sacrificial Carrier

Fan-Out Package Having a Main Die and a Dummy Die

SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURI...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHODS FOR IMPROVING LIGHT SENSOR RESPONSE

SEMICONDUCTOR PACKAGE AND METHOD

SYSTEMS AND METHODS FOR INTEGRATED CIRCUIT LAYOUT

MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCON...

IMAGE SENSOR PIXEL AND METAL SHIELDING OF CHARGE STORAGE DEVICE OF...

VIDEO CONFERENCE DEVICE AND VIDEO CONFERENCE SYSTEM

LAYOUTS FOR CONDUCTIVE LAYERS IN INTEGRATED CIRCUITS

SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURI...

ROUTING STRUCTURE

METHOD FOR TESTING POWER LEAKAGE OF CIRCUIT AND PROCESSING SYSTEM U...

LAYOUTS FOR CONDUCTIVE LAYERS IN INTEGRATED CIRCUITS

THIN-FILM NON-UNIFORM STRESS EVALUATION

METHOD FOR ANALYZING ELECTROMIGRATION (EM) IN INTEGRATED CIRCUIT

IMAGE SENSOR PIXEL AND METAL SHIELDING OF CHARGE STORAGE DEVICE OF...

MULTI-SOCKET PANEL DEVICE WITH ANTI-CROSSTALK STRUCTURE

SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURI...

ROUTING STRUCTURE AND METHOD OF FORMING THE SAME

Fan-Out Package Having a Main Die and a Dummy Die

SYSTEMS AND METHODS FOR INTEGRATED CIRCUIT LAYOUT

METHOD FOR ANALYZING ELECTROMIGRATION (EM) IN INTEGRATED CIRCUIT

CIRCUIT CHECK METHOD AND ELECTRONIC APPARATUS

Device and Method for UBM/RDL Routing

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

THIN-FILM NON-UNIFORM STRESS EVALUATION

METHOD FOR ANALYZING ELECTROMIGRATION (EM) IN INTEGRATED CIRCUIT