Meng Kong Lye

Person

Shah Alam, MY

People

Patents Grantslast 30 patents

Information Patent Grant
QFN semiconductor package, semiconductor package and lead frame
- Patent number 12,051,642
- Issue date Jul 30, 2024
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power die package
- Patent number 11,515,238
- Issue date Nov 29, 2022
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making flexible semiconductor device with graphene tape
- Patent number 11,456,188
- Issue date Sep 27, 2022
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with lead frame that accommodates various die...
- Patent number 11,171,077
- Issue date Nov 9, 2021
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor device with flip-chip die and interposer
- Patent number 10,787,361
- Issue date Sep 29, 2020
- NXP USA, INC.
- Stanley Job Doraisamy
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Hybrid lead frame for semiconductor die package with improved creep...
- Patent number 10,734,311
- Issue date Aug 4, 2020
- NXP USA, INC.
- Mariano Layson Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible semiconductor device with graphene tape
- Patent number 10,692,802
- Issue date Jun 23, 2020
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with bendable leads
- Patent number 10,515,880
- Issue date Dec 24, 2019
- NXP USA, INC.
- Jinzhong Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and lead frame with high density lead array
- Patent number 10,217,697
- Issue date Feb 26, 2019
- NXP B.V.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for integrated circuit device having J-leads and Gull Wi...
- Patent number 10,217,700
- Issue date Feb 26, 2019
- NXP USA, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for integrated circuit device having J-leads and gull wi...
- Patent number 10,181,434
- Issue date Jan 15, 2019
- NXP USA, INC.
- Xingshou Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Woven signal-routing substrate for wearable electronic devices
- Patent number 10,041,195
- Issue date Aug 7, 2018
- NXP USA, INC.
- You Ge
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Grant
Integrated circuit die with corner IO pads
- Patent number 9,633,959
- Issue date Apr 25, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Shailesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package having non-horizontal die pad and flexible substrate the...
- Patent number 9,548,255
- Issue date Jan 17, 2017
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with heat spreader
- Patent number 9,484,289
- Issue date Nov 1, 2016
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with deflecting tie bar for IC package
- Patent number 9,449,901
- Issue date Sep 20, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package having non-horizontal die pad and lead frame therefor
- Patent number 9,379,035
- Issue date Jun 28, 2016
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with heat-dissipating lead frame
- Patent number 9,355,945
- Issue date May 31, 2016
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal bond wire shield
- Patent number 9,337,140
- Issue date May 10, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Shailesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Common pin for multi-die semiconductor package
- Patent number 9,196,578
- Issue date Nov 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Sheau Mei Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stress relief and heat spreader
- Patent number 9,196,576
- Issue date Nov 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with tube based heat spreader
- Patent number 9,190,343
- Issue date Nov 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power bar design for lead frame-based packages
- Patent number 9,177,834
- Issue date Nov 3, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with twisted leads
- Patent number 9,165,869
- Issue date Oct 20, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Soo Choong Chee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved shielding
- Patent number 9,147,656
- Issue date Sep 29, 2015
- Freescale Semicondutor, Inc.
- Sumit Varshney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame based semiconductor device with routing substrate
- Patent number 8,980,690
- Issue date Mar 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Penglin Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integral heat sink
- Patent number 8,901,722
- Issue date Dec 2, 2014
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing surface area of pad limited semiconductor die l...
- Patent number 8,291,368
- Issue date Oct 16, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Chetan Verma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bond pad for semiconductor die
- Patent number 8,242,613
- Issue date Aug 14, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Chetan Verma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
- Publication number 20230110402
- Publication date Apr 13, 2023
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE QFN PACKAGE AND METHOD OF MAKING THEREOF
- Publication number 20230115182
- Publication date Apr 13, 2023
- NXP USA, Inc.
- Meng Kong Lye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE AND LEAD FRAME
- Publication number 20220077052
- Publication date Mar 10, 2022
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LEAD FRAME THAT ACCOMMODATES VARIOUS DIE...
- Publication number 20210013137
- Publication date Jan 14, 2021
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DIE PACKAGE
- Publication number 20200411423
- Publication date Dec 31, 2020
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE
- Publication number 20200312751
- Publication date Oct 1, 2020
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID LEAD FRAME FOR SEMICONDUCTOR DIE PACKAGE WITH IMPROVED CREEP...
- Publication number 20200203262
- Publication date Jun 25, 2020
- NXP USA, Inc.
- Mariano Layson CHING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR DEVICE WITH FLIP-CHIP DIE AND INTERPOSER
- Publication number 20200131026
- Publication date Apr 30, 2020
- NXP USA, Inc.
- Stanley Job Doraisamy
- B60 - VEHICLES IN GENERAL
Information Patent Application
LEAD FRAME WITH BENDABLE LEADS
- Publication number 20190287883
- Publication date Sep 19, 2019
- NXP USA, Inc.
- Jinzhong Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND LEAD FRAME WITH HIGH DENSITY LEAD ARRAY
- Publication number 20180102305
- Publication date Apr 12, 2018
- NXP USA, Inc.
- ZHIJIE WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE
- Publication number 20170358525
- Publication date Dec 14, 2017
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WOVEN SIGNAL-ROUTING SUBSTRATE FOR WEARABLE ELECTRONIC DEVICES
- Publication number 20170009387
- Publication date Jan 12, 2017
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- D03 - WEAVING
Information Patent Application
LEAD FRAME WITH DEFLECTING TIE BAR FOR IC PACKAGE
- Publication number 20160293526
- Publication date Oct 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE WITH CORNER IO PADS
- Publication number 20160233183
- Publication date Aug 11, 2016
- Shailesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER BAR DESIGN FOR LEAD FRAME-BASED PACKAGES
- Publication number 20150235924
- Publication date Aug 20, 2015
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HEAT SPREADER
- Publication number 20150108625
- Publication date Apr 23, 2015
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH STRESS RELIEF AND HEAT SPREADER
- Publication number 20150084169
- Publication date Mar 26, 2015
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRAL HEAT SINK
- Publication number 20140239476
- Publication date Aug 28, 2014
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD FOR SEMICONDUCTOR DIE
- Publication number 20120049389
- Publication date Mar 1, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Chetan Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING SURFACE AREA OF PAD LIMITED SEMICONDUCTOR DIE L...
- Publication number 20110246958
- Publication date Oct 6, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Chetan VERMA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREWITH
- Publication number 20110204498
- Publication date Aug 25, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Yin Kheng Au
- H01 - BASIC ELECTRIC ELEMENTS

Meng Kong Lye

Person

Patents Grantslast 30 patents

QFN semiconductor package, semiconductor package and lead frame

Power die package

Method of making flexible semiconductor device with graphene tape

Semiconductor device with lead frame that accommodates various die...

Sensor device with flip-chip die and interposer

Hybrid lead frame for semiconductor die package with improved creep...

Flexible semiconductor device with graphene tape

Lead frame with bendable leads

Semiconductor device and lead frame with high density lead array

Lead frame for integrated circuit device having J-leads and Gull Wi...

Lead frame for integrated circuit device having J-leads and gull wi...

Woven signal-routing substrate for wearable electronic devices

Integrated circuit die with corner IO pads

IC package having non-horizontal die pad and flexible substrate the...

Semiconductor device with heat spreader

Lead frame with deflecting tie bar for IC package

IC package having non-horizontal die pad and lead frame therefor

Semiconductor device with heat-dissipating lead frame

Signal bond wire shield

Common pin for multi-die semiconductor package

Semiconductor package with stress relief and heat spreader

Semiconductor device with tube based heat spreader

Power bar design for lead frame-based packages

Semiconductor device with twisted leads

Semiconductor device with improved shielding

Lead frame based semiconductor device with routing substrate

Semiconductor device with integral heat sink

Method for reducing surface area of pad limited semiconductor die l...

Bond pad for semiconductor die

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

SEMICONDUCTOR DEVICE QFN PACKAGE AND METHOD OF MAKING THEREOF

QFN SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE AND LEAD FRAME

SEMICONDUCTOR DEVICE WITH LEAD FRAME THAT ACCOMMODATES VARIOUS DIE...

POWER DIE PACKAGE

FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE

HYBRID LEAD FRAME FOR SEMICONDUCTOR DIE PACKAGE WITH IMPROVED CREEP...

SENSOR DEVICE WITH FLIP-CHIP DIE AND INTERPOSER

LEAD FRAME WITH BENDABLE LEADS

SEMICONDUCTOR DEVICE AND LEAD FRAME WITH HIGH DENSITY LEAD ARRAY

FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE

WOVEN SIGNAL-ROUTING SUBSTRATE FOR WEARABLE ELECTRONIC DEVICES

LEAD FRAME WITH DEFLECTING TIE BAR FOR IC PACKAGE

INTEGRATED CIRCUIT DIE WITH CORNER IO PADS

POWER BAR DESIGN FOR LEAD FRAME-BASED PACKAGES

SEMICONDUCTOR DEVICE WITH HEAT SPREADER

SEMICONDUCTOR PACKAGE WITH STRESS RELIEF AND HEAT SPREADER

SEMICONDUCTOR DEVICE WITH INTEGRAL HEAT SINK

BOND PAD FOR SEMICONDUCTOR DIE

METHOD FOR REDUCING SURFACE AREA OF PAD LIMITED SEMICONDUCTOR DIE L...

LEAD FRAME AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREWITH