Meng MEI

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Beijing, CN

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Patents Applicationslast 30 patents

Information Patent Application
CHIP AND METHOD FOR FORMING THE SAME, AND PACKAGE STRUCTURE
- Publication number 20240321801
- Publication date Sep 26, 2024
- Beijing Youzhuju Network Technology Co., Ltd.
- Haiying CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240266245
- Publication date Aug 8, 2024
- Beijing Youzhuju Network Technology Co., Ltd.
- Sijie LI
- H01 - BASIC ELECTRIC ELEMENTS