Meng Meng Vanessa CHONG

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuits having copper bonding structures with silicon c...
- Patent number 9,859,236
- Issue date Jan 2, 2018
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Meng Meng Chong
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Reliable passivation layers for semiconductor devices
- Patent number 9,293,388
- Issue date Mar 22, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Xuesong Rao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUITS HAVING COPPER BONDING STRUCTURES WITH SILICON C...
- Publication number 20170040272
- Publication date Feb 9, 2017
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Meng Meng Chong
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
RELIABLE PASSIVATION LAYERS FOR SEMICONDUCTOR DEVICES
- Publication number 20160181197
- Publication date Jun 23, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Xuesong RAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE PASSIVATION LAYERS FOR SEMICONDUCTOR DEVICES
- Publication number 20150108654
- Publication date Apr 23, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Xuesong RAO
- H01 - BASIC ELECTRIC ELEMENTS