Meng-Pei Lu

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated chip with graphene based interconnect
- Patent number 12,218,060
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with two-dimensional conductive structures
- Patent number 12,068,253
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including liner structure
- Patent number 12,027,419
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection liner on interconnect wire to enlarge processing window...
- Patent number 11,908,794
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,682,616
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Pei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structure and methods for forming the same
- Patent number 11,551,967
- Issue date Jan 10, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Meng-Pei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection liner on interconnect wire to enlarge processing window...
- Patent number 11,309,241
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and forming method thereof
- Patent number 10,879,115
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240363538
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-WEI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE
- Publication number 20240321632
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION LINER ON INTERCONNECT WIRE TO ENLARGE PROCESSING WINDOW...
- Publication number 20240145381
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240055352
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cian-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD MANUFACTURING THE SAME
- Publication number 20240055496
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Pei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING GRAPHENE BARRIER AND METHOD OF FORMI...
- Publication number 20230387239
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP WITH GRAPHENE BASED INTERCONNECT
- Publication number 20230387019
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VERTICLE CONDUCTIVE GRAPHENE AND MET...
- Publication number 20230378067
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsu-Chun KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING SINGLE LAYER SERVING AS BOTH BARRI...
- Publication number 20230352409
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Pei LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING TOPOLOGICAL MATERIAL
- Publication number 20230326857
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Pei LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VERTICLE CONDUCTIVE GRAPHENE AND MET...
- Publication number 20230066891
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsu-Chun KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230037554
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-WEI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20220359378
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- MENG-PEI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT SIMULATION BASED ON RANDOM TELEGRAPH SIGNAL NOISE
- Publication number 20220357390
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Chien-Ming HUNG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED CHIP WITH GRAPHENE BASED INTERCONNECT
- Publication number 20220359413
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE AND METHODS FOR FORMING THE SAME
- Publication number 20220352012
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Meng-Pei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION LINER ON INTERCONNECT WIRE TO ENLARGE PROCESSING WINDOW...
- Publication number 20220238434
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220068799
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- MENG-PEI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE
- Publication number 20210407852
- Publication date Dec 30, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION LINER ON INTERCONNECT WIRE TO ENLARGE PROCESSING WINDOW...
- Publication number 20210398898
- Publication date Dec 23, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE AND METHODS FOR FORMING THE SAME
- Publication number 20210366765
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Meng-Pei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF
- Publication number 20190157144
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC MODULE
- Publication number 20170170378
- Publication date Jun 15, 2017
- National Tsing-Hua University
- Chien-Neng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY EFFICIENT THERMOELECTRIC MATERIAL
- Publication number 20130112909
- Publication date May 9, 2013
- National Tsing Hua University
- Chien-Neng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIMEDIA BROADCAST SYSTEM AND METHOD
- Publication number 20100049864
- Publication date Feb 25, 2010
- National Taiwan University
- Meng-Ting Lu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Meng-Pei Lu

Person

Patents Grantslast 30 patents

Integrated chip with graphene based interconnect

Semiconductor structure with two-dimensional conductive structures

Semiconductor device including liner structure

Protection liner on interconnect wire to enlarge processing window...

Semiconductor structure and method for forming the same

Via structure and methods for forming the same

Protection liner on interconnect wire to enlarge processing window...

Semiconductor device and forming method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE

PROTECTION LINER ON INTERCONNECT WIRE TO ENLARGE PROCESSING WINDOW...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE INCLUDING GRAPHENE BARRIER AND METHOD OF FORMI...

INTEGRATED CHIP WITH GRAPHENE BASED INTERCONNECT

SEMICONDUCTOR STRUCTURE HAVING VERTICLE CONDUCTIVE GRAPHENE AND MET...

INTERCONNECT STRUCTURE INCLUDING SINGLE LAYER SERVING AS BOTH BARRI...

INTERCONNECT STRUCTURE INCLUDING TOPOLOGICAL MATERIAL

SEMICONDUCTOR STRUCTURE HAVING VERTICLE CONDUCTIVE GRAPHENE AND MET...

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

ELECTRONIC CIRCUIT SIMULATION BASED ON RANDOM TELEGRAPH SIGNAL NOISE

INTEGRATED CHIP WITH GRAPHENE BASED INTERCONNECT

VIA STRUCTURE AND METHODS FOR FORMING THE SAME

PROTECTION LINER ON INTERCONNECT WIRE TO ENLARGE PROCESSING WINDOW...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE

PROTECTION LINER ON INTERCONNECT WIRE TO ENLARGE PROCESSING WINDOW...

VIA STRUCTURE AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF

THERMOELECTRIC MODULE

HIGHLY EFFICIENT THERMOELECTRIC MATERIAL

MULTIMEDIA BROADCAST SYSTEM AND METHOD