Meng-Tsung KUO

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Hsinchu County, TW

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Patents Grantslast 30 patents

Information Patent Grant
Structure and formation method of chip package with protective lid
- Patent number 11,978,715
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20240250055
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAM STRUCTURE ON LID TO CONSTRAIN A THERMAL INTERFACE MATERIAL IN A...
- Publication number 20230022643
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wei Teng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH PROTECTIVE LID
- Publication number 20220278069
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsung KUO
- H01 - BASIC ELECTRIC ELEMENTS