TREA

Meng-Wei Chou

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  • Zhubei City, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240395566
    • Publication date Nov 28, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Zi-Jheng Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
    • Publication number 20240379646
    • Publication date Nov 14, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Shin-Puu Jeng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Fan-Out Package with Cavity Substrate
    • Publication number 20240105705
    • Publication date Mar 28, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Po-Hao Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Fan-Out Package with Controllable Standoff
    • Publication number 20230361015
    • Publication date Nov 9, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Po-Hao Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Device
    • Publication number 20230307251
    • Publication date Sep 28, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Zi-Jheng Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Integrated Circuit Packages
    • Publication number 20230105359
    • Publication date Apr 6, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Po-Hao Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Device Including Electromagnetic Interference (EMI) S...
    • Publication number 20220359421
    • Publication date Nov 10, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Po-Yao Chuang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
    • Publication number 20220216192
    • Publication date Jul 7, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Shin-Puu Jeng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
    • Publication number 20210391314
    • Publication date Dec 16, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Shin-Puu Jeng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Fan-Out Package with Controllable Standoff
    • Publication number 20210351118
    • Publication date Nov 11, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Po-Hao TSAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Device and Method of Manufacture
    • Publication number 20210305170
    • Publication date Sep 30, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Po-Yao Chuang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Device
    • Publication number 20210134611
    • Publication date May 6, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Zi-Jheng Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Fan-Out Package with Cavity Substrate
    • Publication number 20210035966
    • Publication date Feb 4, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Po-Hao TSAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Integrated Circuit Package and Method
    • Publication number 20210013053
    • Publication date Jan 14, 2021
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Po-Hao Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Integrated Circuit Package and Method
    • Publication number 20200105663
    • Publication date Apr 2, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Po-Hao Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE STRUCTURE WITH MOLDING LAYER AND METHOD FOR FORMING TH...
    • Publication number 20200006176
    • Publication date Jan 2, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Po-Hao TSAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Fan-out Package with Controllable Standoff
    • Publication number 20200006214
    • Publication date Jan 2, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Po-Hao Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Fan-Out Package with Cavity Substrate
    • Publication number 20200006307
    • Publication date Jan 2, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Po-Hao Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Device and Method
    • Publication number 20180350629
    • Publication date Dec 6, 2018
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Zi-Jheng Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Device and Method
    • Publication number 20170110421
    • Publication date Apr 20, 2017
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Zi-Jheng Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Pillar Bumps and Process for Making Same
    • Publication number 20140363966
    • Publication date Dec 11, 2014
    • Cheng-Chung Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method of Forming Post Passivation Interconnects
    • Publication number 20140015122
    • Publication date Jan 16, 2014
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Meng-Wei Chou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONDUCTIVE PILLAR STRUCTURE
    • Publication number 20120091574
    • Publication date Apr 19, 2012
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Wei LIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Pillar Bumps and Process for Making Same
    • Publication number 20120049346
    • Publication date Mar 1, 2012
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Cheng-Chung Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    UBM Etching Methods
    • Publication number 20120009777
    • Publication date Jan 12, 2012
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chung-Shi Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Preventing UBM Oxidation in Bump Formation Processes
    • Publication number 20110092064
    • Publication date Apr 21, 2011
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chung-Shi Liu
    • H01 - BASIC ELECTRIC ELEMENTS