Meng Yan

Person

Wuhan, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming lead wires in hybrid-bonded semiconductor devices
- Patent number 11,996,322
- Issue date May 28, 2024
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical switch and optical performance monitoring method based on o...
- Patent number 11,962,352
- Issue date Apr 16, 2024
- Huawei Technologies Co., Ltd.
- Liang Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Bonding alignment marks at bonding interface
- Patent number 11,876,049
- Issue date Jan 16, 2024
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming lead wires in hybrid-bonded semiconductor devices
- Patent number 11,670,543
- Issue date Jun 6, 2023
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid wafer bonding method and structure thereof
- Patent number 11,502,058
- Issue date Nov 15, 2022
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming lead wires in hybrid-bonded semiconductor devices
- Patent number 11,322,392
- Issue date May 3, 2022
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding alignment marks at bonding in interface
- Patent number 11,289,422
- Issue date Mar 29, 2022
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming lead wires in hybrid-bonded semiconductor devices
- Patent number 10,763,158
- Issue date Sep 1, 2020
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming dual damascene interconnect structure
- Patent number 10,692,756
- Issue date Jun 23, 2020
- Yangtze Memory Technologies Co., Ltd.
- Jian Xu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD, ELECTRONIC DEVICE, AND SYSTEM FOR CREATING APPLICATION SHOR...
- Publication number 20240295945
- Publication date Sep 5, 2024
- HUAWEI TECHNOLOGIES CO., LTD.
- Puliang LUO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY METHOD AND TERMINAL DEVICE
- Publication number 20240272763
- Publication date Aug 15, 2024
- HUAWEI TECHNOLOGIES CO., LTD.
- Fan Ming
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D MEMORY DEVICE
- Publication number 20230092768
- Publication date Mar 23, 2023
- Yangtze Memory Technologies Co., Ltd.
- Lan YAO
- G11 - INFORMATION STORAGE
Information Patent Application
HYBRID WAFER BONDING METHOD
- Publication number 20230036495
- Publication date Feb 2, 2023
- Yangtze Memory Technologies Co., Ltd.
- Meng YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID WAFER BONDING METHOD AND STRUCTURE THEREOF
- Publication number 20230027015
- Publication date Jan 26, 2023
- Yangtze Memory Technologies Co., Ltd.
- Meng YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Switch and Optical Performance Monitoring Method Based On O...
- Publication number 20230013921
- Publication date Jan 19, 2023
- Huawei Technologies Co., Ltd
- Liang Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR FORMING LEAD WIRES IN HYBRID-BONDED SEMICONDUCTOR DEVICES
- Publication number 20220270919
- Publication date Aug 25, 2022
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING LEAD WIRES IN HYBRID-BONDED SEMICONDUCTOR DEVICES
- Publication number 20220216099
- Publication date Jul 7, 2022
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING ALIGNMENT MARKS AT BONDING INTERFACE
- Publication number 20220173038
- Publication date Jun 2, 2022
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID WAFER BONDING METHOD AND STRUCTURE THEREOF
- Publication number 20210257333
- Publication date Aug 19, 2021
- Yangtze Memory Technologies Co., Ltd.
- Meng YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING ALIGNMENT MARKS AT BONDING INTERFACE
- Publication number 20210072653
- Publication date Mar 11, 2021
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING LEAD WIRES IN HYBRID-BONDED SEMICONDUCTOR DEVICES
- Publication number 20200402841
- Publication date Dec 24, 2020
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING DUAL DAMASCENE INTERCONNECT STRUCTURE
- Publication number 20200211895
- Publication date Jul 2, 2020
- Yangtze Memory Technologies Co., Ltd.
- Jian Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING ALIGNMENT MARKS AT BONDING INTERFACE
- Publication number 20200159133
- Publication date May 21, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Meng Yan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR FORMING LEAD WIRES IN HYBRID-BONDED SEMICONDUCTOR DEVICES
- Publication number 20190088535
- Publication date Mar 21, 2019
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method for forming lead wires in hybrid-bonded semiconductor devices

Optical switch and optical performance monitoring method based on o...

Bonding alignment marks at bonding interface

Method for forming lead wires in hybrid-bonded semiconductor devices

Hybrid wafer bonding method and structure thereof

Method for forming lead wires in hybrid-bonded semiconductor devices

Bonding alignment marks at bonding in interface

Method for forming lead wires in hybrid-bonded semiconductor devices

Method for forming dual damascene interconnect structure

Patents Applicationslast 30 patents

METHOD, ELECTRONIC DEVICE, AND SYSTEM FOR CREATING APPLICATION SHOR...

DISPLAY METHOD AND TERMINAL DEVICE

3D MEMORY DEVICE

HYBRID WAFER BONDING METHOD

HYBRID WAFER BONDING METHOD AND STRUCTURE THEREOF

Optical Switch and Optical Performance Monitoring Method Based On O...

METHOD FOR FORMING LEAD WIRES IN HYBRID-BONDED SEMICONDUCTOR DEVICES

METHOD FOR FORMING LEAD WIRES IN HYBRID-BONDED SEMICONDUCTOR DEVICES

BONDING ALIGNMENT MARKS AT BONDING INTERFACE

HYBRID WAFER BONDING METHOD AND STRUCTURE THEREOF

BONDING ALIGNMENT MARKS AT BONDING INTERFACE

METHOD FOR FORMING LEAD WIRES IN HYBRID-BONDED SEMICONDUCTOR DEVICES

METHOD FOR FORMING DUAL DAMASCENE INTERCONNECT STRUCTURE

BONDING ALIGNMENT MARKS AT BONDING INTERFACE

METHOD FOR FORMING LEAD WIRES IN HYBRID-BONDED SEMICONDUCTOR DEVICES