Mengbin LIU

Person

Ningbo, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Air gap type semiconductor device package structure
- Patent number 11,979,136
- Issue date May 7, 2024
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Yunxiang Di
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint identification module, method for forming fingerprint i...
- Patent number 11,917,918
- Issue date Feb 27, 2024
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hu Shi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Air gap type semiconductor device package structure and fabrication...
- Patent number 11,695,387
- Issue date Jul 4, 2023
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION (SHANGHAI BRANCH)
- Yunxiang Di
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask plate and fabrication method thereof
- Patent number 11,444,244
- Issue date Sep 13, 2022
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Image capturing assembly, lens module and electronic device
- Patent number 11,430,825
- Issue date Aug 30, 2022
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure of wafer-level system-in-package
- Patent number 11,309,279
- Issue date Apr 19, 2022
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image capturing assembly and packaging method thereof, lens module,...
- Patent number 11,296,141
- Issue date Apr 5, 2022
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera assembly and packaging method thereof, lens module, electron...
- Patent number 11,171,166
- Issue date Nov 9, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera assembly and packaging method thereof, lens module, and elec...
- Patent number 11,069,670
- Issue date Jul 20, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mark and semiconductor device, and fabrication methods th...
- Patent number 11,049,816
- Issue date Jun 29, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging method and package structure of wafer-level system-in-pac...
- Patent number 10,930,617
- Issue date Feb 23, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera assembly and packaging methods thereof, lens module, and ele...
- Patent number 10,887,499
- Issue date Jan 5, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method and package structure of wafer-level system-in-pac...
- Patent number 10,861,821
- Issue date Dec 8, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image capturing assembly and packaging method thereof, lens module...
- Patent number 10,861,895
- Issue date Dec 8, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level system-in-package structure and electronic apparatus th...
- Patent number 10,811,385
- Issue date Oct 20, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging methods using a photolithographic bonding mat...
- Patent number 10,755,979
- Issue date Aug 25, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hu Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for wafer-level system in package
- Patent number 10,756,056
- Issue date Aug 25, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor module and method for forming the same
- Patent number 10,490,589
- Issue date Nov 26, 2019
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
AIR GAP TYPE SEMICONDUCTOR DEVICE PACKAGE STRUCTURE
- Publication number 20230291379
- Publication date Sep 14, 2023
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Yunxiang DI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA ASSEMBLY, LENS MODULE, AND ELECTRONIC DEVICE
- Publication number 20220045112
- Publication date Feb 10, 2022
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA ASSEMBLY, LENS MODULE, AND ELECTRONIC DEVICE
- Publication number 20210320095
- Publication date Oct 14, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210280527
- Publication date Sep 9, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FINGERPRINT IDENTIFICATION MODULE, METHOD FOR FORMING FINGERPRINT I...
- Publication number 20210193903
- Publication date Jun 24, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hu SHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGE CAPTURING ASSEMBLY, LENS MODULE AND ELECTRONIC DEVICE
- Publication number 20210066381
- Publication date Mar 4, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE OF WAFER-LEVEL SYSTEM-IN-PACKAGE
- Publication number 20210043601
- Publication date Feb 11, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP TYPE SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND FABRICATION...
- Publication number 20200366267
- Publication date Nov 19, 2020
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Yunxiang DI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE CAPTURING ASSEMBLY AND PACKAGING METHOD THEREOF, LENS MODULE,...
- Publication number 20200161346
- Publication date May 21, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT MARK AND SEMICONDUCTOR DEVICE, AND FABRICATION METHODS TH...
- Publication number 20200161251
- Publication date May 21, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAMERA ASSEMBLY AND PACKAGING METHOD THEREOF, LENS MODULE, AND ELEC...
- Publication number 20200161289
- Publication date May 21, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA ASSEMBLY AND PACKAGING METHODS THEREOF, LENS MODULE, AND ELE...
- Publication number 20200162645
- Publication date May 21, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAMERA ASSEMBLY AND PACKAGING METHOD THEREOF, LENS MODULE, ELECTRON...
- Publication number 20200161350
- Publication date May 21, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE CAPTURING ASSEMBLY AND PACKAGING METHOD THEREOF, LENS MODULE...
- Publication number 20200161359
- Publication date May 21, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA ASSEMBLY AND PACKAGING METHOD, LENS MODULE AND ELECTRONIC DE...
- Publication number 20200161356
- Publication date May 21, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da CHEN
- G02 - OPTICS
Information Patent Application
WAFER-LEVEL PACKAGING METHODS USING A PHOTOLITHOGRAPHIC BONDING MAT...
- Publication number 20200135689
- Publication date Apr 30, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hu SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR MODULE AND METHOD FOR FORMING THE SAME
- Publication number 20200098807
- Publication date Mar 26, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD AND PACKAGE STRUCTURE OF WAFER-LEVEL SYSTEM-IN-PAC...
- Publication number 20190341365
- Publication date Nov 7, 2019
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASK AND FABRICATION METHOD THEREOF
- Publication number 20190341265
- Publication date Nov 7, 2019
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASK PLATE AND FABRICATION METHOD THEREOF
- Publication number 20190326514
- Publication date Oct 24, 2019
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin LIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PACKAGING METHOD AND PACKAGE STRUCTURE OF WAFER-LEVEL SYSTEM-IN-PAC...
- Publication number 20190115316
- Publication date Apr 18, 2019
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR WAFER-LEVEL SYSTEM IN PACKAGE
- Publication number 20190115314
- Publication date Apr 18, 2019
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL SYSTEM-IN-PACKAGE STRUCTURE AND ELECTRONIC APPARATUS TH...
- Publication number 20190103332
- Publication date Apr 4, 2019
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin LIU
- H01 - BASIC ELECTRIC ELEMENTS

Mengbin LIU

Person

Patents Grantslast 30 patents

Air gap type semiconductor device package structure

Fingerprint identification module, method for forming fingerprint i...

Air gap type semiconductor device package structure and fabrication...

Mask plate and fabrication method thereof

Image capturing assembly, lens module and electronic device

Package structure of wafer-level system-in-package

Image capturing assembly and packaging method thereof, lens module,...

Camera assembly and packaging method thereof, lens module, electron...

Camera assembly and packaging method thereof, lens module, and elec...

Alignment mark and semiconductor device, and fabrication methods th...

Packaging method and package structure of wafer-level system-in-pac...

Camera assembly and packaging methods thereof, lens module, and ele...

Packaging method and package structure of wafer-level system-in-pac...

Image capturing assembly and packaging method thereof, lens module...

Wafer-level system-in-package structure and electronic apparatus th...

Wafer-level packaging methods using a photolithographic bonding mat...

Methods and structures for wafer-level system in package

Image sensor module and method for forming the same

Patents Applicationslast 30 patents

AIR GAP TYPE SEMICONDUCTOR DEVICE PACKAGE STRUCTURE

CAMERA ASSEMBLY, LENS MODULE, AND ELECTRONIC DEVICE

CAMERA ASSEMBLY, LENS MODULE, AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

FINGERPRINT IDENTIFICATION MODULE, METHOD FOR FORMING FINGERPRINT I...

IMAGE CAPTURING ASSEMBLY, LENS MODULE AND ELECTRONIC DEVICE

PACKAGE STRUCTURE OF WAFER-LEVEL SYSTEM-IN-PACKAGE

AIR GAP TYPE SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND FABRICATION...

IMAGE CAPTURING ASSEMBLY AND PACKAGING METHOD THEREOF, LENS MODULE,...

ALIGNMENT MARK AND SEMICONDUCTOR DEVICE, AND FABRICATION METHODS TH...

CAMERA ASSEMBLY AND PACKAGING METHOD THEREOF, LENS MODULE, AND ELEC...

CAMERA ASSEMBLY AND PACKAGING METHODS THEREOF, LENS MODULE, AND ELE...

CAMERA ASSEMBLY AND PACKAGING METHOD THEREOF, LENS MODULE, ELECTRON...

IMAGE CAPTURING ASSEMBLY AND PACKAGING METHOD THEREOF, LENS MODULE...

CAMERA ASSEMBLY AND PACKAGING METHOD, LENS MODULE AND ELECTRONIC DE...

WAFER-LEVEL PACKAGING METHODS USING A PHOTOLITHOGRAPHIC BONDING MAT...

IMAGE SENSOR MODULE AND METHOD FOR FORMING THE SAME

PACKAGING METHOD AND PACKAGE STRUCTURE OF WAFER-LEVEL SYSTEM-IN-PAC...

MASK AND FABRICATION METHOD THEREOF

MASK PLATE AND FABRICATION METHOD THEREOF

PACKAGING METHOD AND PACKAGE STRUCTURE OF WAFER-LEVEL SYSTEM-IN-PAC...

METHODS AND STRUCTURES FOR WAFER-LEVEL SYSTEM IN PACKAGE

WAFER-LEVEL SYSTEM-IN-PACKAGE STRUCTURE AND ELECTRONIC APPARATUS TH...