Menglu Li

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Molded silicon on passive package
- Patent number 12,165,956
- Issue date Dec 10, 2024
- Apple Inc.
- Kumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible package architecture concept in fanout
- Patent number 12,074,077
- Issue date Aug 27, 2024
- Apple Inc.
- Karthik Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electronic Devices with Multi-Substrate Stacked Patch Antennas
- Publication number 20240356225
- Publication date Oct 24, 2024
- Apple Inc.
- Trang T. Thai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Silicon on Passive Package
- Publication number 20230178458
- Publication date Jun 8, 2023
- Apple Inc.
- Kumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible Package Architecture Concept in Fanout
- Publication number 20220157680
- Publication date May 19, 2022
- Apple Inc.
- Karthik Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS