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Mengqi LIU
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Hillsboro, OR, US
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last 30 patents
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Patent Grant
Loading mechanism with integrated heatsink
Patent number
11,678,444
Issue date
Jun 13, 2023
Intel Corporation
Olaotan Elenitoba-Johnson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
METHODS AND APPARATUS TO IMPROVE PIN CONTACT OF A COMPONENT STACK
Publication number
20230014898
Publication date
Jan 19, 2023
Intel Corporation
Phil Geng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PATTERNED BOLSTER PLATE AND COMPOSITE BACK PLATE FOR SEMICONDUCTOR...
Publication number
20210410317
Publication date
Dec 30, 2021
Intel Corporation
Phil GENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY CONDUCTIVE CHAMBER WITH STIFFENING STRUCTURE FOR THERMAL...
Publication number
20210410329
Publication date
Dec 30, 2021
Intel Corporation
Jin YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNOLOGIES FOR PROCESSOR LOADING MECHANISMS
Publication number
20210193558
Publication date
Jun 24, 2021
Intel Corporation
Ralph V. Miele
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOADING FRAME FOR HIGH I/O COUNT PACKAGED SEMICONDUCTOR CHIP
Publication number
20210183737
Publication date
Jun 17, 2021
Intel Corporation
Jeffory L. SMALLEY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOADING MECHANISM WITH INTEGRATED HEATSINK
Publication number
20200137896
Publication date
Apr 30, 2020
Intel Corporation
Olaotan ELENITOBA-JOHNSON
G06 - COMPUTING CALCULATING COUNTING