Merrett Wong

Person

San Carlos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Mask shrink layer for high aspect ratio dielectric etch
- Patent number 10,431,458
- Issue date Oct 1, 2019
- Lam Research Corporation
- Eric A. Hudson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask shrink layer for high aspect ratio dielectric etch
- Patent number 9,543,148
- Issue date Jan 10, 2017
- Lam Research Corporation
- Eric A. Hudson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SILICON ETCH WITH ORGANOCHLORIDE
- Publication number 20240429063
- Publication date Dec 26, 2024
- LAM RESEARCH CORPORATION
- Ilya PISKUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple State Pulsing for High Aspect Ratio Etch
- Publication number 20240120205
- Publication date Apr 11, 2024
- LAM RESEARCH CORPORATION
- Aniruddha Joi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ETCHING A HIGH ASPECT RATIO STRUCTURE
- Publication number 20240120209
- Publication date Apr 11, 2024
- LAM RESEARCH CORPORATION
- Nikhil Dole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-BASED LINER PROTECTION FOR HIGH ASPECT RATIO PLASMA ETCH
- Publication number 20230298896
- Publication date Sep 21, 2023
- LAM RESEARCH CORPORATION
- Gregory Clinton Veber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF MASK CD
- Publication number 20230230807
- Publication date Jul 20, 2023
- LAM RESEARCH CORPORATION
- Beibei Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STATE PULSING FOR ACHIEVING A BALANCE BETWEEN BOW CONTROL AND...
- Publication number 20230005717
- Publication date Jan 5, 2023
- LAM RESEARCH CORPORATION
- Nikhil Dole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STATE RF PULSING TO CONTROL MASK SHAPE AND BREAKING SELECTIVI...
- Publication number 20220285130
- Publication date Sep 8, 2022
- LAM RESEARCH CORPORATION
- Nikhil Dole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASK SHRINK LAYER FOR HIGH ASPECT RATIO DIELECTRIC ETCH
- Publication number 20170076945
- Publication date Mar 16, 2017
- LAM RESEARCH CORPORATION
- Eric A. Hudson
- H01 - BASIC ELECTRIC ELEMENTS

Merrett Wong

Person

Patents Grantslast 30 patents

Mask shrink layer for high aspect ratio dielectric etch

Mask shrink layer for high aspect ratio dielectric etch

Patents Applicationslast 30 patents

SILICON ETCH WITH ORGANOCHLORIDE

Multiple State Pulsing for High Aspect Ratio Etch

SYSTEMS AND METHODS FOR ETCHING A HIGH ASPECT RATIO STRUCTURE

METAL-BASED LINER PROTECTION FOR HIGH ASPECT RATIO PLASMA ETCH

CONTROL OF MASK CD

MULTI-STATE PULSING FOR ACHIEVING A BALANCE BETWEEN BOW CONTROL AND...

MULTI-STATE RF PULSING TO CONTROL MASK SHAPE AND BREAKING SELECTIVI...

MASK SHRINK LAYER FOR HIGH ASPECT RATIO DIELECTRIC ETCH