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Suwon-city, KR
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Patents Grants
last 30 patents
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Patent Grant
Method of forming a via hole through a glass wafer
Patent number
7,084,073
Issue date
Aug 1, 2006
Samsung Electronics Co., Ltd.
Moon-chul Lee
B81 - MICRO-STRUCTURAL TECHNOLOGY
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last 30 patents
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Patent Application
Method of forming a via hole through a glass wafer
Publication number
20040092105
Publication date
May 13, 2004
Moon-chul Lee
B81 - MICRO-STRUCTURAL TECHNOLOGY