Mi Jeong Jeon

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Suwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 12,028,973
- Issue date Jul 2, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chan Jin Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,022,621
- Issue date Jun 25, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi Jeong Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 12,016,130
- Issue date Jun 18, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chan Jin Park
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20240298411
- Publication date Sep 5, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chan Jin Park
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230337367
- Publication date Oct 19, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Mi Jeong JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20220386473
- Publication date Dec 1, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Chan Jin Park
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220217842
- Publication date Jul 7, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Chan Jin Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR