Miao-Pei Chen

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Wafer surface defect inspection method and apparatus thereof
- Patent number 12,044,631
- Issue date Jul 23, 2024
- GlobalWafers Co., Ltd.
- Shang-Chi Wang
- G01 - MEASURING TESTING
Information Patent Grant
Wafer processing system and rework method thereof
- Patent number 11,971,365
- Issue date Apr 30, 2024
- GlobalWafers Co., Ltd.
- Shang-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer inspection method and apparatus thereof
- Patent number 11,852,465
- Issue date Dec 26, 2023
- GlobalWafers Co., Ltd.
- Shang-Chi Wang
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
WAFER PROCESSING SYSTEM AND REWORK METHOD THEREOF
- Publication number 20220326162
- Publication date Oct 13, 2022
- GLOBALWAFERS CO., LTD.
- Shang-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER INSPECTION METHOD AND APPARATUS THEREOF
- Publication number 20220316872
- Publication date Oct 6, 2022
- GLOBALWAFERS CO., LTD.
- Shang-Chi Wang
- G01 - MEASURING TESTING
Information Patent Application
WAFER SURFACE DEFECT INSPECTION METHOD AND APPARATUS THEREOF
- Publication number 20220307991
- Publication date Sep 29, 2022
- GLOBALWAFERS CO., LTD.
- Shang-Chi Wang
- G01 - MEASURING TESTING