Miao-Wen Chen

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Taichung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing multi-chip package
- Patent number 9,887,102
- Issue date Feb 6, 2018
- Siliconware Precision Industries Co., Ltd.
- Tai-Tsung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method for manufacturing the same
- Patent number 9,305,885
- Issue date Apr 5, 2016
- Siliconware Precision Industries Co., Ltd.
- Tai-Tsung Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING MULTI-CHIP PACKAGE
- Publication number 20160181126
- Publication date Jun 23, 2016
- Siliconware Precision Industries Co., Ltd.
- Tai-Tsung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140231972
- Publication date Aug 21, 2014
- Siliconware Precision Industries Co., Ltd.
- Tai-Tsung Hsu
- H01 - BASIC ELECTRIC ELEMENTS