Michael A. Leach

Person

Winooski, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer polishing and endpoint detection
- Patent number RE38029
- Issue date Mar 11, 2003
- IBM Corporation
- William J. Cote
- 438 - Semiconductor device manufacturing: process
Information Patent Grant
Refractory metal-titanium nitride conductive structures
- Patent number 5,760,475
- Issue date Jun 2, 1998
- International Business Machines Corporation
- John Edward Cronin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishstop planarization structure
- Patent number 5,510,652
- Issue date Apr 23, 1996
- International Business Machines Corporation
- Peter A. Burke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishstop planarization method and structure
- Patent number 5,356,513
- Issue date Oct 18, 1994
- International Business Machines Corporation
- Peter A. Burke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for detecting an end point in polishing operations
- Patent number 5,242,524
- Issue date Sep 7, 1993
- International Business Machines Corporation
- Michael A. Leach
- B24 - GRINDING POLISHING
Information Patent Grant
Device and method for detecting an end point in polishing operation
- Patent number 5,213,655
- Issue date May 25, 1993
- International Business Machines Corporation
- Michael A. Leach
- B24 - GRINDING POLISHING
Information Patent Grant
Method of forming conductors within an insulating substrate
- Patent number 5,136,124
- Issue date Aug 4, 1992
- International Business Machines Corporation
- John E. Cronin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of measuring changes in impedance of a variable impedance lo...
- Patent number 5,132,617
- Issue date Jul 21, 1992
- International Business Machines Corp.
- Michael A. Leach
- B24 - GRINDING POLISHING
Information Patent Grant
Method of forming conductors within an insulating substrate
- Patent number 4,985,990
- Issue date Jan 22, 1991
- International Business Machines Corporation
- John E. Cronin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via-filling and planarization technique
- Patent number 4,956,313
- Issue date Sep 11, 1990
- International Business Machines Corporation
- William J. Cote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for mechanical planarization
- Patent number 4,934,102
- Issue date Jun 19, 1990
- International Business Machines Corporation
- Michael A. Leach
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer flood polishing
- Patent number 4,910,155
- Issue date Mar 20, 1990
- International Business Machines Corporation
- William J. Cote
- B24 - GRINDING POLISHING
Information Patent Grant
Process for defining organic sidewall structures
- Patent number 4,838,991
- Issue date Jun 13, 1989
- International Business Machines Corporation
- William J. Cote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In situ conductivity monitoring technique for chemical/mechanical p...
- Patent number 4,793,895
- Issue date Dec 27, 1988
- IBM Corporation
- Carter W. Kaanta
- B24 - GRINDING POLISHING
Information Patent Grant
VLSI coaxial wiring structure
- Patent number 4,776,087
- Issue date Oct 11, 1988
- International Business Machines Corporation
- John E. Cronin
- H01 - BASIC ELECTRIC ELEMENTS

Michael A. Leach

Person

Patents Grantslast 30 patents

Wafer polishing and endpoint detection

Refractory metal-titanium nitride conductive structures

Polishstop planarization structure

Polishstop planarization method and structure

Device for detecting an end point in polishing operations

Device and method for detecting an end point in polishing operation

Method of forming conductors within an insulating substrate

Method of measuring changes in impedance of a variable impedance lo...

Method of forming conductors within an insulating substrate

Via-filling and planarization technique

System for mechanical planarization

Wafer flood polishing

Process for defining organic sidewall structures

In situ conductivity monitoring technique for chemical/mechanical p...

VLSI coaxial wiring structure