Michael Althar

Person

Melbourne, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a circuit module
- Patent number 10,582,617
- Issue date Mar 3, 2020
- Intersil Americas LLC
- Jian Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor structure including inductors with negligible magnetic cou...
- Patent number 10,529,475
- Issue date Jan 7, 2020
- Intersil Americas LLC
- Jian Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-to-back stacked dies
- Patent number 10,290,618
- Issue date May 14, 2019
- Intersil Americas LLC
- Francois Hebert
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Circuit module such as a high-density lead frame array (HDA) power...
- Patent number 9,717,146
- Issue date Jul 25, 2017
- Intersil Americas LLC
- Jian Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-to-back stacked dies
- Patent number 9,524,957
- Issue date Dec 20, 2016
- Intersil Americas LLC
- Francois Hebert
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACK-TO-BACK STACKED DIES
- Publication number 20190267365
- Publication date Aug 29, 2019
- INTERSIL AMERICAS LLC
- Francois Hebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE SUCH AS A HIGH-DENSITY LEAD FRAME ARRAY POWER MODULE...
- Publication number 20170325333
- Publication date Nov 9, 2017
- INTERSIL AMERICAS LLC
- Jian YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-TO-BACK STACKED DIES
- Publication number 20170053904
- Publication date Feb 23, 2017
- INTERSIL AMERICAS LLC
- Francois Hebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE SUCH AS A HIGH-DENSITY LEAD FRAME ARRAY (HDA) POWER...
- Publication number 20130314879
- Publication date Nov 28, 2013
- INTERSIL AMERICAS LLC
- Jian YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR STRUCTURE INCLUDING INDUCTORS WITH NEGLIGIBLE MAGNETIC COU...
- Publication number 20130106500
- Publication date May 2, 2013
- INTERSIL AMERICAS LLC
- Jian YIN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
BACK-TO-BACK STACKED DIES
- Publication number 20130043940
- Publication date Feb 21, 2013
- INTERSIL AMERICAS LLC
- Francois Hebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER-SUPPLY MODULE WITH ELECTROMAGNETIC-INTERFERENCE (EMI) SHIELDI...
- Publication number 20120063038
- Publication date Mar 15, 2012
- Intersil Americas Inc.
- Jian YIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Michael Althar

Person

Patents Grantslast 30 patents

Method of fabricating a circuit module

Inductor structure including inductors with negligible magnetic cou...

Back-to-back stacked dies

Circuit module such as a high-density lead frame array (HDA) power...

Back-to-back stacked dies

Patents Applicationslast 30 patents

BACK-TO-BACK STACKED DIES

CIRCUIT MODULE SUCH AS A HIGH-DENSITY LEAD FRAME ARRAY POWER MODULE...

BACK-TO-BACK STACKED DIES

CIRCUIT MODULE SUCH AS A HIGH-DENSITY LEAD FRAME ARRAY (HDA) POWER...

INDUCTOR STRUCTURE INCLUDING INDUCTORS WITH NEGLIGIBLE MAGNETIC COU...

BACK-TO-BACK STACKED DIES

POWER-SUPPLY MODULE WITH ELECTROMAGNETIC-INTERFERENCE (EMI) SHIELDI...