Michael B. Rattner

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Silicon-containing structure with deep etched features, and method...
- Patent number 7,618,548
- Issue date Nov 17, 2009
- Applied Materials, Inc.
- Jeffrey D. Chinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of plasma etching a deeply recessed feature in a substrate u...
- Patent number 7,074,723
- Issue date Jul 11, 2006
- Applied Materials, Inc.
- Jeffrey D. Chinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated method for release and passivation of MEMS structures
- Patent number 6,902,947
- Issue date Jun 7, 2005
- Applied Materials, Inc.
- Jeffrey D. Chinn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of etching variable depth features in a crystalline substrate
- Patent number 6,900,133
- Issue date May 31, 2005
- Applied Materials, Inc.
- Jeffrey D. Chinn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of etching a deep trench having a tapered profile in silicon
- Patent number 6,849,554
- Issue date Feb 1, 2005
- Applied Materials, Inc.
- Michael Rattner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of smoothing a trench sidewall after a deep trench silicon e...
- Patent number 6,846,746
- Issue date Jan 25, 2005
- Applied Materials, Inc.
- Michael Rattner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated method for release and passivation of MEMS structures
- Patent number 6,830,950
- Issue date Dec 14, 2004
- Applied Materials, Inc.
- Jeffrey D. Chinn
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Silicon-containing structure with deep etched features, and method...
- Publication number 20060205238
- Publication date Sep 14, 2006
- Jeffrey D. Chinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate carrier for processing substrates
- Publication number 20050241771
- Publication date Nov 3, 2005
- APPLIED MATERIALS, INC.
- Michael B. Rattner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Disposable barrier technique for through wafer etching in MEMS
- Publication number 20040087054
- Publication date May 6, 2004
- APPLIED MATERIALS, INC.
- Jeffrey D. Chinn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of etching variable depth features in a crystalline substrate
- Publication number 20040053505
- Publication date Mar 18, 2004
- Jeffrey D. Chinn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Integrated method for release and passivation of MEMS structures
- Publication number 20040033639
- Publication date Feb 19, 2004
- APPLIED MATERIALS, INC.
- Jeffrey D. Chinn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF PLASMA ETCHING A DEEPLY RECESSED FEATURE IN A SUBSTRATE U...
- Publication number 20040023508
- Publication date Feb 5, 2004
- APPLIED MATERIALS, INC.
- Jeffrey D. Chinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate carrier for processing substrates
- Publication number 20030219986
- Publication date Nov 27, 2003
- APPLIED MATERIALS, INC.
- Michael B. Rattner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate support assembly having an edge protector
- Publication number 20030217693
- Publication date Nov 27, 2003
- APPLIED MATERIALS, INC.
- Michael B. Rattner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of smoothing a trench sidewall after a deep trench silicon e...
- Publication number 20030211752
- Publication date Nov 13, 2003
- Michael Rattner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of etching a deep trench having a tapered profile in silicon
- Publication number 20030207579
- Publication date Nov 6, 2003
- Michael Rattner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated method for release and passivation of MEMS structures
- Publication number 20030166342
- Publication date Sep 4, 2003
- APPLIED MATERIALS, INC.
- Jeffrey D. Chinn
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Michael B. Rattner

Person

Patents Grantslast 30 patents

Silicon-containing structure with deep etched features, and method...

Method of plasma etching a deeply recessed feature in a substrate u...

Integrated method for release and passivation of MEMS structures

Method of etching variable depth features in a crystalline substrate

Method of etching a deep trench having a tapered profile in silicon

Method of smoothing a trench sidewall after a deep trench silicon e...

Integrated method for release and passivation of MEMS structures

Patents Applicationslast 30 patents

Silicon-containing structure with deep etched features, and method...

Substrate carrier for processing substrates

Disposable barrier technique for through wafer etching in MEMS

Method of etching variable depth features in a crystalline substrate

Integrated method for release and passivation of MEMS structures

METHOD OF PLASMA ETCHING A DEEPLY RECESSED FEATURE IN A SUBSTRATE U...

Substrate carrier for processing substrates

Substrate support assembly having an edge protector

Method of smoothing a trench sidewall after a deep trench silicon e...

Method of etching a deep trench having a tapered profile in silicon

Integrated method for release and passivation of MEMS structures