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Michael B. Vincent
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Efficient wave guide transition between package and PCB using solde...
Patent number
11,963,291
Issue date
Apr 16, 2024
NXP B.V.
Leo van Gemert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with connector in package and method therefor
Patent number
11,961,776
Issue date
Apr 16, 2024
NXP USA, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package thermal spreader having integrated EF/EMI shi...
Patent number
11,935,809
Issue date
Mar 19, 2024
NXP USA, INC.
Zhiwei Gong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with directing structure and method therefor
Patent number
11,876,059
Issue date
Jan 16, 2024
NXP USA, INC.
Robert Joseph Wenzel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with waveguide and method therefor
Patent number
11,837,560
Issue date
Dec 5, 2023
NXP USA, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package having stress isolation and method the...
Patent number
11,823,968
Issue date
Nov 21, 2023
NXP USA, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package having thermal dissipation feature and...
Patent number
11,817,366
Issue date
Nov 14, 2023
NXP USA, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device packaging warpage control
Patent number
11,791,283
Issue date
Oct 17, 2023
NXP USA, INC.
Scott M. Hayes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package
Patent number
11,777,204
Issue date
Oct 3, 2023
NXP B.V.
Giorgio Carluccio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
No-gel pressure sensor package
Patent number
11,760,623
Issue date
Sep 19, 2023
NXP USA, INC.
Stephen Ryan Hooper
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor device packaging warpage control
Patent number
11,728,285
Issue date
Aug 15, 2023
NXP USA, INC.
Vivek Gupta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having integrated antenna and method therefor
Patent number
11,705,410
Issue date
Jul 18, 2023
NXP USA, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Topside heatsinking antenna launcher for an integrated circuit package
Patent number
11,631,625
Issue date
Apr 18, 2023
NXP USA, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a translation feature and method therefor
Patent number
11,557,544
Issue date
Jan 17, 2023
NXP USA, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package thermal spreader having integrated RF/EMI shi...
Patent number
11,557,525
Issue date
Jan 17, 2023
NXP USA, INC.
Zhiwei Gong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composite media protection for pressure sensor
Patent number
11,532,532
Issue date
Dec 20, 2022
NXP USA, INC.
Michael B. Vincent
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
No-gel pressure sensor package
Patent number
11,498,829
Issue date
Nov 15, 2022
NXP USA, INC.
Stephen Ryan Hooper
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Topside heatsinking antenna launcher for an integrated circuit package
Patent number
11,456,227
Issue date
Sep 27, 2022
NXP USA, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device packaging warpage control
Patent number
11,404,288
Issue date
Aug 2, 2022
NXP USA, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method, system, and apparatus for forming three-dimensional semicon...
Patent number
11,335,652
Issue date
May 17, 2022
NXP USA, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bottom-side heatsinking waveguide for an integrated circuit package
Patent number
11,276,654
Issue date
Mar 15, 2022
NXP USA, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with waveguide and method therefor
Patent number
11,133,273
Issue date
Sep 28, 2021
NXP USA, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package comprising an encapsulated and conduct...
Patent number
11,133,578
Issue date
Sep 28, 2021
NXP B.V.
Antonius Hendrikus Jozef Kamphuis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Grounding lids in integrated circuit devices
Patent number
11,127,645
Issue date
Sep 21, 2021
NXP USA, INC.
Dwight Lee Daniels
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with compact antenna formed using three-dimen...
Patent number
11,121,467
Issue date
Sep 14, 2021
NXP USA, INC.
Jinbang Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package integrated waveguide
Patent number
11,031,681
Issue date
Jun 8, 2021
NXP USA, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plated opening with vent path
Patent number
10,834,817
Issue date
Nov 10, 2020
NXP USA, INC.
Michael B. Vincent
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Shielded semiconductor device and lead frame therefor
Patent number
10,654,709
Issue date
May 19, 2020
NXP USA, INC.
Lee Fee Ngion
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
High aspect ratio connection for EMI shielding
Patent number
10,658,303
Issue date
May 19, 2020
NXP USA, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Shielded package with integrated antenna
Patent number
10,529,670
Issue date
Jan 7, 2020
NXP USA, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DOUBLE-SIDED MULTICHIP PACKAGES
Publication number
20240186301
Publication date
Jun 6, 2024
NXP USA, Inc.
Scott M. Hayes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTICHIP PACKAGES WITH 3D INTEGRATION
Publication number
20240186303
Publication date
Jun 6, 2024
NXP USA, Inc.
Zhiwei Gong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TWO-PART MOLDING OF DEVICE PACKAGES WITH SPACERS
Publication number
20240170357
Publication date
May 23, 2024
NXP USA, Inc.
Ankur Shah
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
SEMICONDUCTOR DEVICE WITH ACTIVE MOLD PACKAGE AND METHOD THEREFOR
Publication number
20240105660
Publication date
Mar 28, 2024
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH PACKAGE VIA AND METHOD THEREFOR
Publication number
20240088068
Publication date
Mar 14, 2024
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE WITH MOLD-EMBEDDED INDUCTOR AND METHOD OF FABRICATION THEREFOR
Publication number
20240055415
Publication date
Feb 15, 2024
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH ENCLOSED CAVITY AND METHOD THEREFOR
Publication number
20230402408
Publication date
Dec 14, 2023
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
Publication number
20230369248
Publication date
Nov 16, 2023
NXP USA, Inc.
Scott M. Hayes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Efficient Wave Guide Transition Between Package and PCB Using Solde...
Publication number
20230345623
Publication date
Oct 26, 2023
NXP B.V.
Leo van Gemert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD THEREFOR
Publication number
20230307403
Publication date
Sep 28, 2023
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH OPEN CAVITY AND METHOD THEREFOR
Publication number
20230268304
Publication date
Aug 24, 2023
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH OPEN CAVITY AND METHOD THEREFOR
Publication number
20230178508
Publication date
Jun 8, 2023
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH CONNECTOR IN PACKAGE AND METHOD THEREFOR
Publication number
20230170270
Publication date
Jun 1, 2023
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH LOW LOSS WAVEGUIDE INTERFACE AND METHOD T...
Publication number
20230127033
Publication date
Apr 27, 2023
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE THERMAL SPREADER HAVING INTEGRATED EF/EMI SHI...
Publication number
20230106555
Publication date
Apr 6, 2023
NXP USA, Inc.
Zhiwei Gong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
Publication number
20230066652
Publication date
Mar 2, 2023
NXP USA, Inc.
Vivek Gupta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NO-GEL PRESSURE SENSOR PACKAGE
Publication number
20230059566
Publication date
Feb 23, 2023
NXP USA, Inc.
Stephen Ryan Hooper
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR DEVICE WITH RF INTERPOSER AND METHOD THEREFOR
Publication number
20230044903
Publication date
Feb 9, 2023
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH SELF-ALIGNED WAVEGUIDE AND METHOD THEREFOR
Publication number
20230017646
Publication date
Jan 19, 2023
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
Publication number
20220392777
Publication date
Dec 8, 2022
NXP USA, Inc.
Zhiwei Gong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TOPSIDE HEATSINKING ANTENNA LAUNCHER FOR AN INTEGRATED CIRCUIT PACKAGE
Publication number
20220392821
Publication date
Dec 8, 2022
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE THERMAL SPREADER HAVING INTEGRATED RF/EMI SHI...
Publication number
20220384299
Publication date
Dec 1, 2022
NXP USA, Inc.
Zhiwei Gong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH DIRECTING STRUCTURE AND METHOD THEREFOR
Publication number
20220367389
Publication date
Nov 17, 2022
NXP USA, Inc.
Robert Joseph Wenzel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING THERMAL DISSIPATION FEATURE AND...
Publication number
20220344235
Publication date
Oct 27, 2022
NXP USA, Inc.
Scott M. Hayes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
Publication number
20220336371
Publication date
Oct 20, 2022
NXP USA, Inc.
Scott M. Hayes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE
Publication number
20220231408
Publication date
Jul 21, 2022
NXP B.V.
Giorgio Carluccio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING INTEGRATED ANTENNA AND METHOD THEREFOR
Publication number
20220189890
Publication date
Jun 16, 2022
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING THERMAL DISSIPATION FEATURE AND...
Publication number
20220181230
Publication date
Jun 9, 2022
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING A TRANSLATION FEATURE AND METHOD THEREFOR
Publication number
20220068828
Publication date
Mar 3, 2022
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING STRESS ISOLATION AND METHOD THE...
Publication number
20220068738
Publication date
Mar 3, 2022
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS