Michael B. Vincent

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with low loss waveguide interface and method t...
- Patent number 12,288,927
- Issue date Apr 29, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with open cavity and method therefor
- Patent number 12,288,766
- Issue date Apr 29, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with open cavity and method therefor
- Patent number 12,243,842
- Issue date Mar 4, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging warpage control
- Patent number 12,125,716
- Issue date Oct 22, 2024
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with self-aligned waveguide and method therefor
- Patent number 12,033,950
- Issue date Jul 9, 2024
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient wave guide transition between package and PCB using solde...
- Patent number 11,963,291
- Issue date Apr 16, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with connector in package and method therefor
- Patent number 11,961,776
- Issue date Apr 16, 2024
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package thermal spreader having integrated EF/EMI shi...
- Patent number 11,935,809
- Issue date Mar 19, 2024
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with directing structure and method therefor
- Patent number 11,876,059
- Issue date Jan 16, 2024
- NXP USA, INC.
- Robert Joseph Wenzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with waveguide and method therefor
- Patent number 11,837,560
- Issue date Dec 5, 2023
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having stress isolation and method the...
- Patent number 11,823,968
- Issue date Nov 21, 2023
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having thermal dissipation feature and...
- Patent number 11,817,366
- Issue date Nov 14, 2023
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging warpage control
- Patent number 11,791,283
- Issue date Oct 17, 2023
- NXP USA, INC.
- Scott M. Hayes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package
- Patent number 11,777,204
- Issue date Oct 3, 2023
- NXP B.V.
- Giorgio Carluccio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No-gel pressure sensor package
- Patent number 11,760,623
- Issue date Sep 19, 2023
- NXP USA, INC.
- Stephen Ryan Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method
- Patent number 11,749,624
- Issue date Sep 5, 2023
- NXP B.V.
- Abdellatif Zanati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging warpage control
- Patent number 11,728,285
- Issue date Aug 15, 2023
- NXP USA, INC.
- Vivek Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having integrated antenna and method therefor
- Patent number 11,705,410
- Issue date Jul 18, 2023
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Topside heatsinking antenna launcher for an integrated circuit package
- Patent number 11,631,625
- Issue date Apr 18, 2023
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a translation feature and method therefor
- Patent number 11,557,544
- Issue date Jan 17, 2023
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package thermal spreader having integrated RF/EMI shi...
- Patent number 11,557,525
- Issue date Jan 17, 2023
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite media protection for pressure sensor
- Patent number 11,532,532
- Issue date Dec 20, 2022
- NXP USA, INC.
- Michael B. Vincent
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
No-gel pressure sensor package
- Patent number 11,498,829
- Issue date Nov 15, 2022
- NXP USA, INC.
- Stephen Ryan Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Topside heatsinking antenna launcher for an integrated circuit package
- Patent number 11,456,227
- Issue date Sep 27, 2022
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging warpage control
- Patent number 11,404,288
- Issue date Aug 2, 2022
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, system, and apparatus for forming three-dimensional semicon...
- Patent number 11,335,652
- Issue date May 17, 2022
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-side heatsinking waveguide for an integrated circuit package
- Patent number 11,276,654
- Issue date Mar 15, 2022
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with waveguide and method therefor
- Patent number 11,133,273
- Issue date Sep 28, 2021
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising an encapsulated and conduct...
- Patent number 11,133,578
- Issue date Sep 28, 2021
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grounding lids in integrated circuit devices
- Patent number 11,127,645
- Issue date Sep 21, 2021
- NXP USA, INC.
- Dwight Lee Daniels
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE PACKAGES WITH INTEGRATED MILLIMETER-WAVE REFLECTOR CAVITIES
- Publication number 20250087604
- Publication date Mar 13, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED MULTICHIP PACKAGES WITH DIRECT DIE-TO-DIE COUPLING
- Publication number 20250079381
- Publication date Mar 6, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH OPEN CAVITY AND METHOD THEREFOR
- Publication number 20250029947
- Publication date Jan 23, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
- Publication number 20250006511
- Publication date Jan 2, 2025
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURE
- Publication number 20240413192
- Publication date Dec 12, 2024
- NXP B.V.
- Paul Southworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH RIGID-FLEX SUB-ASSEMBLY AND METHOD THEREFOR
- Publication number 20240363519
- Publication date Oct 31, 2024
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELF-ALIGNED WAVEGUIDE AND METHOD THEREFOR
- Publication number 20240332206
- Publication date Oct 3, 2024
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED MULTICHIP PACKAGES
- Publication number 20240186301
- Publication date Jun 6, 2024
- NXP USA, Inc.
- Scott M. Hayes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP PACKAGES WITH 3D INTEGRATION
- Publication number 20240186303
- Publication date Jun 6, 2024
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-PART MOLDING OF DEVICE PACKAGES WITH SPACERS
- Publication number 20240170357
- Publication date May 23, 2024
- NXP USA, Inc.
- Ankur Shah
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE WITH ACTIVE MOLD PACKAGE AND METHOD THEREFOR
- Publication number 20240105660
- Publication date Mar 28, 2024
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH PACKAGE VIA AND METHOD THEREFOR
- Publication number 20240088068
- Publication date Mar 14, 2024
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH MOLD-EMBEDDED INDUCTOR AND METHOD OF FABRICATION THEREFOR
- Publication number 20240055415
- Publication date Feb 15, 2024
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENCLOSED CAVITY AND METHOD THEREFOR
- Publication number 20230402408
- Publication date Dec 14, 2023
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
- Publication number 20230369248
- Publication date Nov 16, 2023
- NXP USA, Inc.
- Scott M. Hayes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Efficient Wave Guide Transition Between Package and PCB Using Solde...
- Publication number 20230345623
- Publication date Oct 26, 2023
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD THEREFOR
- Publication number 20230307403
- Publication date Sep 28, 2023
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH OPEN CAVITY AND METHOD THEREFOR
- Publication number 20230268304
- Publication date Aug 24, 2023
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH OPEN CAVITY AND METHOD THEREFOR
- Publication number 20230178508
- Publication date Jun 8, 2023
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONNECTOR IN PACKAGE AND METHOD THEREFOR
- Publication number 20230170270
- Publication date Jun 1, 2023
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LOW LOSS WAVEGUIDE INTERFACE AND METHOD T...
- Publication number 20230127033
- Publication date Apr 27, 2023
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE THERMAL SPREADER HAVING INTEGRATED EF/EMI SHI...
- Publication number 20230106555
- Publication date Apr 6, 2023
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
- Publication number 20230066652
- Publication date Mar 2, 2023
- NXP USA, Inc.
- Vivek Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO-GEL PRESSURE SENSOR PACKAGE
- Publication number 20230059566
- Publication date Feb 23, 2023
- NXP USA, Inc.
- Stephen Ryan Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH RF INTERPOSER AND METHOD THEREFOR
- Publication number 20230044903
- Publication date Feb 9, 2023
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELF-ALIGNED WAVEGUIDE AND METHOD THEREFOR
- Publication number 20230017646
- Publication date Jan 19, 2023
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
- Publication number 20220392777
- Publication date Dec 8, 2022
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOPSIDE HEATSINKING ANTENNA LAUNCHER FOR AN INTEGRATED CIRCUIT PACKAGE
- Publication number 20220392821
- Publication date Dec 8, 2022
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE THERMAL SPREADER HAVING INTEGRATED RF/EMI SHI...
- Publication number 20220384299
- Publication date Dec 1, 2022
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DIRECTING STRUCTURE AND METHOD THEREFOR
- Publication number 20220367389
- Publication date Nov 17, 2022
- NXP USA, Inc.
- Robert Joseph Wenzel
- H01 - BASIC ELECTRIC ELEMENTS

Michael B. Vincent

Person

Patents Grantslast 30 patents

Semiconductor device with low loss waveguide interface and method t...

Semiconductor device with open cavity and method therefor

Semiconductor device with open cavity and method therefor

Semiconductor device packaging warpage control

Semiconductor device with self-aligned waveguide and method therefor

Efficient wave guide transition between package and PCB using solde...

Semiconductor device with connector in package and method therefor

Semiconductor package thermal spreader having integrated EF/EMI shi...

Semiconductor device with directing structure and method therefor

Semiconductor device with waveguide and method therefor

Semiconductor device package having stress isolation and method the...

Semiconductor device package having thermal dissipation feature and...

Semiconductor device packaging warpage control

Package

No-gel pressure sensor package

Semiconductor device and method

Semiconductor device packaging warpage control

Semiconductor device having integrated antenna and method therefor

Topside heatsinking antenna launcher for an integrated circuit package

Semiconductor device having a translation feature and method therefor

Semiconductor package thermal spreader having integrated RF/EMI shi...

Composite media protection for pressure sensor

No-gel pressure sensor package

Topside heatsinking antenna launcher for an integrated circuit package

Semiconductor device packaging warpage control

Method, system, and apparatus for forming three-dimensional semicon...

Bottom-side heatsinking waveguide for an integrated circuit package

Semiconductor device with waveguide and method therefor

Semiconductor device package comprising an encapsulated and conduct...

Grounding lids in integrated circuit devices

Patents Applicationslast 30 patents

DEVICE PACKAGES WITH INTEGRATED MILLIMETER-WAVE REFLECTOR CAVITIES

DOUBLE-SIDED MULTICHIP PACKAGES WITH DIRECT DIE-TO-DIE COUPLING

SEMICONDUCTOR DEVICE WITH OPEN CAVITY AND METHOD THEREFOR

SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL

ISOLATION STRUCTURE

SEMICONDUCTOR DEVICE WITH RIGID-FLEX SUB-ASSEMBLY AND METHOD THEREFOR

SEMICONDUCTOR DEVICE WITH SELF-ALIGNED WAVEGUIDE AND METHOD THEREFOR

DOUBLE-SIDED MULTICHIP PACKAGES

MULTICHIP PACKAGES WITH 3D INTEGRATION

TWO-PART MOLDING OF DEVICE PACKAGES WITH SPACERS

SEMICONDUCTOR DEVICE WITH ACTIVE MOLD PACKAGE AND METHOD THEREFOR

SEMICONDUCTOR DEVICE WITH THROUGH PACKAGE VIA AND METHOD THEREFOR

PACKAGE WITH MOLD-EMBEDDED INDUCTOR AND METHOD OF FABRICATION THEREFOR

SEMICONDUCTOR DEVICE WITH ENCLOSED CAVITY AND METHOD THEREFOR

SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL

Efficient Wave Guide Transition Between Package and PCB Using Solde...

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD THEREFOR

SEMICONDUCTOR DEVICE WITH OPEN CAVITY AND METHOD THEREFOR

SEMICONDUCTOR DEVICE WITH OPEN CAVITY AND METHOD THEREFOR

SEMICONDUCTOR DEVICE WITH CONNECTOR IN PACKAGE AND METHOD THEREFOR

SEMICONDUCTOR DEVICE WITH LOW LOSS WAVEGUIDE INTERFACE AND METHOD T...

SEMICONDUCTOR PACKAGE THERMAL SPREADER HAVING INTEGRATED EF/EMI SHI...

SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL

NO-GEL PRESSURE SENSOR PACKAGE

SEMICONDUCTOR DEVICE WITH RF INTERPOSER AND METHOD THEREFOR

SEMICONDUCTOR DEVICE WITH SELF-ALIGNED WAVEGUIDE AND METHOD THEREFOR

SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL

TOPSIDE HEATSINKING ANTENNA LAUNCHER FOR AN INTEGRATED CIRCUIT PACKAGE

SEMICONDUCTOR PACKAGE THERMAL SPREADER HAVING INTEGRATED RF/EMI SHI...

SEMICONDUCTOR DEVICE WITH DIRECTING STRUCTURE AND METHOD THEREFOR