Michael B. Vincent

Person

Endwell, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device comprising electrically stable copper filled elec...
- Patent number 8,293,141
- Issue date Oct 23, 2012
- International Business Machines Corporation
- Michael Gaynes
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electrically stable copper filled electrically conductive adhesive
- Patent number 7,763,188
- Issue date Jul 27, 2010
- International Business Machines Corporation
- Michael Gaynes
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
SMT passive device noflow underfill methodology and structure
- Patent number 7,408,264
- Issue date Aug 5, 2008
- International Business Machines Corporation
- Clément J. Fortin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SMT passive device noflow underfill methodology and structure
- Patent number 7,109,592
- Issue date Sep 19, 2006
- International Business Machines Corporation
- Clément J. Fortin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging integrated circuits with adhesive posts
- Patent number 7,094,966
- Issue date Aug 22, 2006
- International Business Machines Corporation
- Barry A. Bonitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip package with underfill having low density filler
- Patent number 6,815,258
- Issue date Nov 9, 2004
- International Business Machines Corporation
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SMT passive device noflow underfill methodology and structure
- Patent number 6,739,497
- Issue date May 25, 2004
- International Busines Machines Corporation
- Clément J. Fortin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip package with underfill having low density filler
- Patent number 6,674,172
- Issue date Jan 6, 2004
- International Business Machines Corporation
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICALLY STABLE COPPER FILLED ELECTRICALLY CONDUCTIVE ADHESIVE
- Publication number 20080230262
- Publication date Sep 25, 2008
- Internationa Business Machines Corporation
- Michael Gaynes
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PROCESS FOR PREPARING AN ELECTRICALLY STABLE COPPER FILLED ELECTRIC...
- Publication number 20080223604
- Publication date Sep 18, 2008
- International Business Machines Corporation
- Michael Gaynes
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SMT passive device noflow underfill methodology and structure
- Publication number 20060290008
- Publication date Dec 28, 2006
- International Business Machines Corporation
- Clement J. Fortin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electrically stable copper filled electrically conductive adhesive
- Publication number 20060197065
- Publication date Sep 7, 2006
- International Business Machines Corporation
- Michael Gaynes
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SMT passive device noflow underfill methodology and structure
- Publication number 20040180469
- Publication date Sep 16, 2004
- Clement J. Fortin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Packaging integrated circuits with adhesive posts
- Publication number 20040075990
- Publication date Apr 22, 2004
- International Business Machines Corporation
- Barry A. Bonitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip package with underfill having low density filler
- Publication number 20040026792
- Publication date Feb 12, 2004
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMT passive device noflow underfill methodology and structure
- Publication number 20030209590
- Publication date Nov 13, 2003
- International Business Machines Corporation
- Clement J. Fortin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flip-chip package with underfill having low density filler
- Publication number 20020167077
- Publication date Nov 14, 2002
- International Business Machines Corporation
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS

Michael B. Vincent

Person

Patents Grantslast 30 patents

Electronic device comprising electrically stable copper filled elec...

Electrically stable copper filled electrically conductive adhesive

SMT passive device noflow underfill methodology and structure

SMT passive device noflow underfill methodology and structure

Packaging integrated circuits with adhesive posts

Flip-chip package with underfill having low density filler

SMT passive device noflow underfill methodology and structure

Flip-chip package with underfill having low density filler

Patents Applicationslast 30 patents

ELECTRICALLY STABLE COPPER FILLED ELECTRICALLY CONDUCTIVE ADHESIVE

PROCESS FOR PREPARING AN ELECTRICALLY STABLE COPPER FILLED ELECTRIC...

SMT passive device noflow underfill methodology and structure

Electrically stable copper filled electrically conductive adhesive

SMT passive device noflow underfill methodology and structure

Packaging integrated circuits with adhesive posts

Flip-chip package with underfill having low density filler

SMT passive device noflow underfill methodology and structure

Flip-chip package with underfill having low density filler