Michael Barrow

Person

El Dorado Hills, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Perimeter matrix ball grid array circuit package with a populated c...
- Patent number 7,543,377
- Issue date Jun 9, 2009
- Intel Corporation
- Michael Barrow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Perimeter matrix ball grid array circuit package with a populated c...
- Patent number 6,747,362
- Issue date Jun 8, 2004
- Intel Corporation
- Michael Barrow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal spreading enhancements for motherboards using PBGAs
- Patent number 6,521,845
- Issue date Feb 18, 2003
- Intel Corporation
- Michael Barrow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package that includes a thermally conductive tap...
- Patent number 6,498,390
- Issue date Dec 24, 2002
- Intel Corporation
- Michael Barrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with bond wires at the corners of an int...
- Patent number 6,420,651
- Issue date Jul 16, 2002
- Intel Corporation
- Michael Barrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with bond wires at the corners of an int...
- Patent number 6,297,078
- Issue date Oct 2, 2001
- Intel Corporation
- Michael Barrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat pack integrated circuit package
- Patent number 6,255,135
- Issue date Jul 3, 2001
- Intel Corporation
- Michael Barrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity mold cap BGA package with post mold thermally conductive epo...
- Patent number 6,146,921
- Issue date Nov 14, 2000
- Intel Corporation
- Michael Barrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with rectangular contact pads
- Patent number 6,118,182
- Issue date Sep 12, 2000
- Intel Corporation
- Michael Barrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a custom corner attach heat sink design for...
- Patent number 6,110,762
- Issue date Aug 29, 2000
- Intel Corporation
- Michael Barrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat pack integrated circuit package
- Patent number 5,978,224
- Issue date Nov 2, 1999
- Intel Corporation
- Michael Barrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat pack integrated circuit package
- Patent number 5,949,651
- Issue date Sep 7, 1999
- Intel Corporation
- Michael Barrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package that has a substrate with an array of hollow vi...
- Patent number 5,936,848
- Issue date Aug 10, 1999
- Intel Corporation
- Behrooz Mehr
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Corner heat sink which encloses an integrated circuit of a ball gri...
- Patent number 5,917,702
- Issue date Jun 29, 1999
- Intel Corporation
- Michael Barrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Custom corner attach heat sink design for a plastic ball grid array...
- Patent number 5,898,219
- Issue date Apr 27, 1999
- Intel Corporation
- Michael Barrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Perimeter matrix ball grid array circuit package with a populated c...
- Patent number 5,894,410
- Issue date Apr 13, 1999
- Intel Corporation
- Michael Barrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package substrate with stepped solder mask openings
- Patent number 5,889,655
- Issue date Mar 30, 1999
- Intel Corporation
- Michael Barrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon metal-pillar conductors under stagger bond pads
- Patent number 5,880,529
- Issue date Mar 9, 1999
- Intel Corporation
- Michael Barrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eclipse via in pad structure
- Patent number 5,875,102
- Issue date Feb 23, 1999
- Intel Corporation
- Michael Barrow
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Quad flat pack integrated circuit package
- Patent number 5,867,367
- Issue date Feb 2, 1999
- Intel Corporation
- Michael Barrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Small diameter ball grid array pad size for improved motherboard ro...
- Patent number 5,812,379
- Issue date Sep 22, 1998
- Intel Corporation
- Michael Barrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable pitch stagger die for optimal density
- Patent number 5,801,450
- Issue date Sep 1, 1998
- Intel Corporation
- Michael Barrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array integrated circuit package that has vias located wi...
- Patent number 5,796,589
- Issue date Aug 18, 1998
- Intel Corporation
- Michael Barrow
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array integrated circuit package that has vias located wi...
- Patent number 5,706,178
- Issue date Jan 6, 1998
- Intel Corporation
- Michael Barrow
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit pattern for a ball grid array integrated circuit package
- Patent number 5,650,660
- Issue date Jul 22, 1997
- Mike Barrow
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PERIMETER MATRIX BALL GRID ARRAY CIRCUIT PACKAGE WITH A POPULATED C...
- Publication number 20080064138
- Publication date Mar 13, 2008
- Intel Corporation
- Michael Barrow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Perimeter matrix ball grid array circuit package with a populated c...
- Publication number 20060180345
- Publication date Aug 17, 2006
- MICHAEL BARROW
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Perimeter matrix ball grid array circuit package with a populated c...
- Publication number 20040262038
- Publication date Dec 30, 2004
- MICHAEL BARROW
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PERIMETER MATRIX BALL GRID ARRAY CIRCUIT PACKAGE WITH A POPULATED C...
- Publication number 20020057558
- Publication date May 16, 2002
- MICHAEL BARROW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH BOND WIRES AT THE CORNERS OF AN INT...
- Publication number 20020050379
- Publication date May 2, 2002
- Michael Barrow
- H01 - BASIC ELECTRIC ELEMENTS

Michael Barrow

Person

Patents Grantslast 30 patents

Perimeter matrix ball grid array circuit package with a populated c...

Perimeter matrix ball grid array circuit package with a populated c...

Thermal spreading enhancements for motherboards using PBGAs

Integrated circuit package that includes a thermally conductive tap...

Integrated circuit package with bond wires at the corners of an int...

Integrated circuit package with bond wires at the corners of an int...

Quad flat pack integrated circuit package

Cavity mold cap BGA package with post mold thermally conductive epo...

Integrated circuit package with rectangular contact pads

Method of manufacturing a custom corner attach heat sink design for...

Quad flat pack integrated circuit package

Quad flat pack integrated circuit package

Electronics package that has a substrate with an array of hollow vi...

Corner heat sink which encloses an integrated circuit of a ball gri...

Custom corner attach heat sink design for a plastic ball grid array...

Perimeter matrix ball grid array circuit package with a populated c...

Integrated circuit package substrate with stepped solder mask openings

Silicon metal-pillar conductors under stagger bond pads

Eclipse via in pad structure

Quad flat pack integrated circuit package

Small diameter ball grid array pad size for improved motherboard ro...

Variable pitch stagger die for optimal density

Ball grid array integrated circuit package that has vias located wi...

Ball grid array integrated circuit package that has vias located wi...

Circuit pattern for a ball grid array integrated circuit package

Patents Applicationslast 30 patents

PERIMETER MATRIX BALL GRID ARRAY CIRCUIT PACKAGE WITH A POPULATED C...

Perimeter matrix ball grid array circuit package with a populated c...

Perimeter matrix ball grid array circuit package with a populated c...

PERIMETER MATRIX BALL GRID ARRAY CIRCUIT PACKAGE WITH A POPULATED C...

INTEGRATED CIRCUIT PACKAGE WITH BOND WIRES AT THE CORNERS OF AN INT...