Michael Barrow

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Exposed die overmolded flip chip package and fabrication method
- Patent number 8,847,372
- Issue date Sep 30, 2014
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed die overmolded flip chip package and fabrication method
- Patent number 8,541,260
- Issue date Sep 24, 2013
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed die overmolded flip chip package and fabrication method
- Patent number 8,476,748
- Issue date Jul 2, 2013
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed die overmolded flip chip package
- Patent number 8,368,194
- Issue date Feb 5, 2013
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed die overmolded flip chip package method
- Patent number 8,207,022
- Issue date Jun 26, 2012
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed die overmolded flip chip package and fabrication method
- Patent number 7,898,093
- Issue date Mar 1, 2011
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS