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Michael Bourbina
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Midland, MI, US
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Patents Grants
last 30 patents
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Patent Grant
Wafer bonding system and method for bonding and debonding thereof
Patent number
9,029,269
Issue date
May 12, 2015
Dow Corning Corporation
Michael Bourbina
B32 - LAYERED PRODUCTS
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Patent Grant
Method for analyzing irregular shaped chunked silicon for contaminates
Patent number
5,361,128
Issue date
Nov 1, 1994
Hemlock Semiconductor Corporation
Michael Bourbina
C30 - CRYSTAL GROWTH
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Patent Grant
Float zone processing of particulate silicon
Patent number
5,108,720
Issue date
Apr 28, 1992
Hemlock Semiconductor Corporation
Michael Bourbina
C30 - CRYSTAL GROWTH
Patents Applications
last 30 patents
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Patent Application
Wafer Bonding System and Method for Bonding and Debonding Thereof
Publication number
20140057450
Publication date
Feb 27, 2014
Michael Bourbina
B32 - LAYERED PRODUCTS