Michael Boyle

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Rock Hill, SC, US

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Patents Grantslast 30 patents

Information Patent Grant
Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces
- Patent number 8,986,789
- Issue date Mar 24, 2015
- Atotech Deutschland GmbH
- Albrecht Uhlig
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
STRESS-REDUCED NI-P/PD STACKS FOR BONDABLE WAFER SURFACES
- Publication number 20110200842
- Publication date Aug 18, 2011
- Atotech Deutschland GmbH
- Albrecht Uhlig
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...