Michael Bruce

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Precision probe positioning for at-speed integrated circuit testing...
- Patent number 10,012,692
- Issue date Jul 3, 2018
- Larry Ross
- G01 - MEASURING TESTING
Information Patent Grant
At-speed integrated circuit testing using through silicon in-circui...
- Patent number 9,714,978
- Issue date Jul 25, 2017
- Larry Ross
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor chip with backside conductor structure
- Patent number 8,519,391
- Issue date Aug 27, 2013
- GLOBALFOUNDRIES Inc.
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon photon detector
- Patent number 8,232,586
- Issue date Jul 31, 2012
- GlobalFoundries Inc.
- Ronald M. Potok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid immersion lens lithography
- Patent number 8,187,772
- Issue date May 29, 2012
- GLOBALFOUNDRIES Inc.
- Rama R. Goruganthu
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor chip with backside conductor structure
- Patent number 8,048,689
- Issue date Nov 1, 2011
- GLOBALFOUNDRIES Inc.
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive integrated circuit mounting structures
- Patent number 7,272,010
- Issue date Sep 18, 2007
- Advanced Micro Devices, Inc.
- Miguel Santana, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical probing of SOI circuits
- Patent number 7,235,800
- Issue date Jun 26, 2007
- Advanced Micro Devices, Inc.
- Rama R. Goruganthu
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor die analysis as a function of optical reflections fro...
- Patent number 7,196,800
- Issue date Mar 27, 2007
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
Three-dimensional tomography
- Patent number 7,088,852
- Issue date Aug 8, 2006
- Advanced Micro Devices, Inc.
- Michael R. Bruce
- G01 - MEASURING TESTING
Information Patent Grant
Resistivity analysis
- Patent number 7,062,399
- Issue date Jun 13, 2006
- Advance Micro Devices, Inc.
- Michael R. Bruce
- G01 - MEASURING TESTING
Information Patent Grant
Optical analysis of integrated circuits
- Patent number 7,019,511
- Issue date Mar 28, 2006
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
Thermally conductive integrated circuit mounting structures
- Patent number 6,994,584
- Issue date Feb 7, 2006
- Advanced Micro Devices, Inc.
- Miguel Santana, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-differential interferometry for silicon device damage detection
- Patent number 6,992,773
- Issue date Jan 31, 2006
- Advanced Micro Devices, Inc.
- Michael R. Bruce
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit defect analysis using liquid crystal
- Patent number 6,956,385
- Issue date Oct 18, 2005
- Advanced Micro Devices, Inc.
- Michael R. Bruce
- G01 - MEASURING TESTING
Information Patent Grant
Laser beam induced phenomena detection
- Patent number 6,897,664
- Issue date May 24, 2005
- Advanced Micro Devices, Inc.
- Michael Bruce
- G01 - MEASURING TESTING
Information Patent Grant
Circuit analysis and manufacture using electric field-induced effects
- Patent number 6,894,518
- Issue date May 17, 2005
- Advanced Micro Devices, Inc.
- Michael R. Bruce
- G01 - MEASURING TESTING
Information Patent Grant
Circuit analysis using electric field-induced effects
- Patent number 6,891,390
- Issue date May 10, 2005
- Advanced Micro Devices
- Rama R. Goruganthu
- G01 - MEASURING TESTING
Information Patent Grant
Localized heating for defect isolation during die operation
- Patent number 6,873,166
- Issue date Mar 29, 2005
- Advance Micro Devices, Inc.
- Michael R. Bruce
- G01 - MEASURING TESTING
Information Patent Grant
Indirect stimulation of an integrated circuit die
- Patent number 6,870,379
- Issue date Mar 22, 2005
- Advanced Micro Devices, Inc.
- Brennan V. Davis
- G01 - MEASURING TESTING
Information Patent Grant
IC die analysis via back side lens
- Patent number 6,864,972
- Issue date Mar 8, 2005
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor die analysis via fiber optic communication
- Patent number 6,850,081
- Issue date Feb 1, 2005
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
Fiber optic semiconductor analysis arrangement and method therefor
- Patent number 6,844,928
- Issue date Jan 18, 2005
- Advanced Micro Devices, Inc.
- Glen P. Gilfeather
- G01 - MEASURING TESTING
Information Patent Grant
High resolution heat exchange
- Patent number 6,836,132
- Issue date Dec 28, 2004
- Advance Micro Devices, Inc.
- Michael R. Bruce
- G01 - MEASURING TESTING
Information Patent Grant
Photon beacon
- Patent number 6,833,718
- Issue date Dec 21, 2004
- Advanced Micro Devices, Inc.
- David Bethke
- G01 - MEASURING TESTING
Information Patent Grant
Electro-optical analysis of integrated circuits
- Patent number 6,833,716
- Issue date Dec 21, 2004
- Advanced Micro Devices, Inc.
- Rama R. Goruganthu
- G01 - MEASURING TESTING
Information Patent Grant
Photon detection enhancement of superconducting hot-electron photod...
- Patent number 6,828,809
- Issue date Dec 7, 2004
- Advanced Micro Devices, Inc.
- Michael R. Bruce
- G01 - MEASURING TESTING
Information Patent Grant
Substrate removal as a function of emitted photons at the back side...
- Patent number 6,806,166
- Issue date Oct 19, 2004
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanotube tip for atomic force microscope
- Patent number 6,780,664
- Issue date Aug 24, 2004
- Advanced Micro Devices, Inc.
- Rama R. Goruganthu
- G01 - MEASURING TESTING
Information Patent Grant
Optical analysis for SOI integrated circuits
- Patent number 6,716,683
- Issue date Apr 6, 2004
- Advanced Mircor Devices, Inc.
- Michael R. Bruce
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
PRECISION PROBE POSITIONING FOR AT-SPEED INTEGRATED CIRCUIT TESTING...
- Publication number 20170299653
- Publication date Oct 19, 2017
- Larry Ross
- G01 - MEASURING TESTING
Information Patent Application
PRECISION PROBE POSITIONING FOR AT-SPEED INTEGRATED CIRCUIT TESTING...
- Publication number 20150355274
- Publication date Dec 10, 2015
- Larry Ross
- G01 - MEASURING TESTING
Information Patent Application
AT-SPEED INTEGRATED CIRCUIT TESTING USING THROUGH SILICON IN-CIRCUI...
- Publication number 20140149811
- Publication date May 29, 2014
- Larry Ross
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR CHIP WITH BACKSIDE CONDUCTOR STRUCTURE
- Publication number 20120007075
- Publication date Jan 12, 2012
- GLOBALFOUNDRIES INC.
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Photon Detector
- Publication number 20110037107
- Publication date Feb 17, 2011
- Ronald M. Potok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip with Backside Conductor Structure
- Publication number 20100072620
- Publication date Mar 25, 2010
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid immersion lens lithography
- Publication number 20060078637
- Publication date Apr 13, 2006
- Rama R. Goruganthu
- B82 - NANO-TECHNOLOGY
Information Patent Application
SOI die analysis of circuitry logic states via coupling through the...
- Publication number 20020084792
- Publication date Jul 4, 2002
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING

Michael Bruce

Person

Patents Grantslast 30 patents

Precision probe positioning for at-speed integrated circuit testing...

At-speed integrated circuit testing using through silicon in-circui...

Semiconductor chip with backside conductor structure

Silicon photon detector

Solid immersion lens lithography

Semiconductor chip with backside conductor structure

Thermally conductive integrated circuit mounting structures

Electrical probing of SOI circuits

Semiconductor die analysis as a function of optical reflections fro...

Three-dimensional tomography

Resistivity analysis

Optical analysis of integrated circuits

Thermally conductive integrated circuit mounting structures

Dual-differential interferometry for silicon device damage detection

Integrated circuit defect analysis using liquid crystal

Laser beam induced phenomena detection

Circuit analysis and manufacture using electric field-induced effects

Circuit analysis using electric field-induced effects

Localized heating for defect isolation during die operation

Indirect stimulation of an integrated circuit die

IC die analysis via back side lens

Semiconductor die analysis via fiber optic communication

Fiber optic semiconductor analysis arrangement and method therefor

High resolution heat exchange

Photon beacon

Electro-optical analysis of integrated circuits

Photon detection enhancement of superconducting hot-electron photod...

Substrate removal as a function of emitted photons at the back side...

Nanotube tip for atomic force microscope

Optical analysis for SOI integrated circuits

Patents Applicationslast 30 patents

PRECISION PROBE POSITIONING FOR AT-SPEED INTEGRATED CIRCUIT TESTING...

PRECISION PROBE POSITIONING FOR AT-SPEED INTEGRATED CIRCUIT TESTING...

AT-SPEED INTEGRATED CIRCUIT TESTING USING THROUGH SILICON IN-CIRCUI...

SEMICONDUCTOR CHIP WITH BACKSIDE CONDUCTOR STRUCTURE

Silicon Photon Detector

Semiconductor Chip with Backside Conductor Structure

Solid immersion lens lithography

SOI die analysis of circuitry logic states via coupling through the...