Michael C. Ayukawa

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Brockville, CA

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Patents Applicationslast 30 patents

Information Patent Application
ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER
- Publication number 20130056868
- Publication date Mar 7, 2013
- AGERE SYSTEMS LLC
- Vance D. Archer
- H01 - BASIC ELECTRIC ELEMENTS