Michael C. Garner

Person

Pleasanton, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming a high conductivity diamond film and structures...
- Patent number 7,553,694
- Issue date Jun 30, 2009
- Kramadhati V. Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a high conductivity diamond film and structures...
- Patent number 7,501,330
- Issue date Mar 10, 2009
- Intel Corporation
- Kramadhati V. Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly including a die having an integrated circuit an...
- Patent number 7,432,532
- Issue date Oct 7, 2008
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a high conductivity diamond film and structures...
- Patent number 7,417,255
- Issue date Aug 26, 2008
- Intel Corporation
- Kramadhati V. Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly including a die having an integrated circuit an...
- Patent number 7,170,098
- Issue date Jan 30, 2007
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly including a die having an integrated circuit an...
- Patent number 6,921,706
- Issue date Jul 26, 2005
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded liquid pump and microchannel cooling system
- Patent number 6,785,134
- Issue date Aug 31, 2004
- Intel Corporation
- James G. Maveety
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly including a die having an integrated circuit an...
- Patent number 6,770,966
- Issue date Aug 3, 2004
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
One step capillary underfill integration for semiconductor packages
- Publication number 20060138643
- Publication date Jun 29, 2006
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
One step capillary underfill integration for semiconductor packages
- Publication number 20060138622
- Publication date Jun 29, 2006
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low dielectric constant carbon films
- Publication number 20060024977
- Publication date Feb 2, 2006
- Kramadhati V. Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low dielectric constant carbon films
- Publication number 20050224807
- Publication date Oct 13, 2005
- Kramadhati V. Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming a high conductivity diamond film and structures...
- Publication number 20050189544
- Publication date Sep 1, 2005
- Kramadhati V. Ravi
- C30 - CRYSTAL GROWTH
Information Patent Application
Methods of forming a high conductivity diamond film and structures...
- Publication number 20050112793
- Publication date May 26, 2005
- Kramadhati V. Ravi
- C30 - CRYSTAL GROWTH
Information Patent Application
EMBEDDED LIQUID PUMP AND MICROCHANNEL COOLING SYSTEM
- Publication number 20040130874
- Publication date Jul 8, 2004
- James G. Maveety
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming a high conductivity diamond film and structures...
- Publication number 20040108506
- Publication date Jun 10, 2004
- Kramadhati V. Ravi
- C30 - CRYSTAL GROWTH

Michael C. Garner

Person

Patents Grantslast 30 patents

Methods of forming a high conductivity diamond film and structures...

Methods of forming a high conductivity diamond film and structures...

Electronic assembly including a die having an integrated circuit an...

Methods of forming a high conductivity diamond film and structures...

Electronic assembly including a die having an integrated circuit an...

Electronic assembly including a die having an integrated circuit an...

Embedded liquid pump and microchannel cooling system

Electronic assembly including a die having an integrated circuit an...

Patents Applicationslast 30 patents

One step capillary underfill integration for semiconductor packages

One step capillary underfill integration for semiconductor packages

Low dielectric constant carbon films

Low dielectric constant carbon films

Methods of forming a high conductivity diamond film and structures...

Methods of forming a high conductivity diamond film and structures...

EMBEDDED LIQUID PUMP AND MICROCHANNEL COOLING SYSTEM

Methods of forming a high conductivity diamond film and structures...