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Michael C. Smith
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Costa Mesta, CA, US
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last 30 patents
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Patent Grant
Ultrasonic wire bonder wire formation and cutter system
Patent number
4,976,392
Issue date
Dec 11, 1990
Orthodyne Electronics Corporation
Michael C. Smith
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Grant
Ultrasonic wire bond touchdown sensor
Patent number
4,438,880
Issue date
Mar 27, 1984
Orthodyne Electronics Corporation
Michael C. Smith
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Grant
Method and apparatus for bonding and breaking leads to semiconductors
Patent number
3,954,217
Issue date
May 4, 1976
Orthodyne Electronics
Michael C. Smith
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR