Michael Christopher D'Imperio

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Lancaster, PA, US

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Patents Grantslast 30 patents

Information Patent Grant
Insulation crimp with lead-in projection
- Patent number 10,553,963
- Issue date Feb 4, 2020
- TE Connectivity Corporation
- Chong Hun Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe for a contact module and method of manufacturing the same
- Patent number 9,246,293
- Issue date Jan 26, 2016
- Tyco Electronics Corporation
- Michael Joseph Vino
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEADFRAME FOR A CONTACT MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150118921
- Publication date Apr 30, 2015
- Tyco Electronics Corporation
- Michael Joseph Vino
- H01 - BASIC ELECTRIC ELEMENTS