TREA

Michael D. Holcomb

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  • Cadott, WI, US
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Patents Applicationslast 30 patents

  • Information Patent Application

    Crack resistant interconnect module
    • Publication number 20040104463
    • Publication date Jun 3, 2004
    • Robin E. Gorrell
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Crack resistant interconnect module
    • Publication number 20040099958
    • Publication date May 27, 2004
    • William R. Schildgen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR