Michael E. S. Chapman

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Gilbert, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming a semiconductor package and structure thereof
- Patent number 7,030,469
- Issue date Apr 18, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Dave S. Mahadevan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with flag support structure
- Patent number 7,012,324
- Issue date Mar 14, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Gary G. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacturing same
- Patent number 6,683,370
- Issue date Jan 27, 2004
- Motorola, Inc.
- William G. McDonald
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of forming a semiconductor package and structure thereof
- Publication number 20050067676
- Publication date Mar 31, 2005
- Dave S. Mahadevan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame with flag support structure
- Publication number 20050056920
- Publication date Mar 17, 2005
- Gary G. Li
- H01 - BASIC ELECTRIC ELEMENTS