Michael Ehmann

Person

Villach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating a semiconductor device using wet etching and...
- Patent number 12,018,387
- Issue date Jun 25, 2024
- Infineon Technologies Austria AG
- Saurabh Roy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic device, electronic module and methods for fabricating th...
- Patent number 11,615,963
- Issue date Mar 28, 2023
- Infineon Technologies AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, electronic module and methods for fabricating th...
- Patent number 10,741,402
- Issue date Aug 11, 2020
- Infineon Technologies AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder metallization stack and methods of formation thereof
- Patent number 10,573,611
- Issue date Feb 25, 2020
- Infineon Technologies AG
- Kamil Karlovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder metallization stack and methods of formation thereof
- Patent number 10,115,688
- Issue date Oct 30, 2018
- Infineon Technologies AG
- Kamil Karlovsky
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE USING WET ETCHING AND...
- Publication number 20240318320
- Publication date Sep 26, 2024
- Infineon Technologies Austria AG
- Saurabh Roy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE USING WET ETCHING AND...
- Publication number 20220235470
- Publication date Jul 28, 2022
- Saurabh Roy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...
- Publication number 20200343094
- Publication date Oct 29, 2020
- INFINEON TECHNOLOGIES AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Metallization Stack and Methods of Formation Thereof
- Publication number 20190051624
- Publication date Feb 14, 2019
- INFINEON TECHNOLOGIES AG
- Kamil Karlovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...
- Publication number 20180082848
- Publication date Mar 22, 2018
- INFINEON TECHNOLOGIES AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Metallization Stack and Methods of Formation Thereof
- Publication number 20160351516
- Publication date Dec 1, 2016
- INFINEON TECHNOLOGIES AG
- Kamil Karlovsky
- H01 - BASIC ELECTRIC ELEMENTS

Michael Ehmann

Person

Patents Grantslast 30 patents

Method for fabricating a semiconductor device using wet etching and...

Electronic device, electronic module and methods for fabricating th...

Electronic device, electronic module and methods for fabricating th...

Solder metallization stack and methods of formation thereof

Solder metallization stack and methods of formation thereof

Patents Applicationslast 30 patents

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE USING WET ETCHING AND...

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE USING WET ETCHING AND...

ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...

Solder Metallization Stack and Methods of Formation Thereof

ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...

Solder Metallization Stack and Methods of Formation Thereof