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Michael Emmett
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Poughkeepsie, NY, US
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last 30 patents
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Patent Grant
Method for assembling a multi-layered ceramic package
Patent number
6,332,946
Issue date
Dec 25, 2001
International Business Machines Corporation
Michael Emmett
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for controlling thermal interface gap distance
Patent number
6,294,408
Issue date
Sep 25, 2001
International Business Machines Corporation
David L. Edwards
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Fixture for multi-layered ceramic package assembly
Patent number
6,112,795
Issue date
Sep 5, 2000
International Business Machines Corporation
Michael Emmett
H01 - BASIC ELECTRIC ELEMENTS