Michael Francis Sweeney

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Portland, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Multi-diameter unplugged component hole(s) on a printed circuit boa...
- Patent number 8,923,007
- Issue date Dec 30, 2014
- Oracle America, Inc.
- Michael Francis Sweeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond strength and interconnection in a via
- Patent number 8,431,831
- Issue date Apr 30, 2013
- Oracle America, Inc.
- Michael Francis Sweeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTI-DIAMETER UNPLUGGED COMPONENT HOLE(S) ON A PRINTED CIRCUIT BOA...
- Publication number 20100085717
- Publication date Apr 8, 2010
- SUN MICROSYSTEMS, INC.
- Michael Francis Sweeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOND STRENGTH AND INTERCONNECTION IN A VIA
- Publication number 20100084178
- Publication date Apr 8, 2010
- SUN MICROSYSTEMS, INC.
- Michael Francis Sweeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR