Michael Fuegl

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Neumarkt, DE

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Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package with Balanced Impedance
- Publication number 20240079297
- Publication date Mar 7, 2024
- INFINEON TECHNOLOGIES AG
- Peter Luniewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED INLAY
- Publication number 20230369177
- Publication date Nov 16, 2023
- Marcus Boehm
- H01 - BASIC ELECTRIC ELEMENTS