Michael G. Todd

Person

Anaheim Hills, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic packaging materials for use with low-k dielectric-contai...
- Patent number 7,582,510
- Issue date Sep 1, 2009
- Henkel Corporation
- Michael G. Todd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic acid containing compositions and methods for use thereof
- Patent number 6,882,058
- Issue date Apr 19, 2005
- Henkel Corporation
- Bruce C. B. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and a method for making the same
- Patent number 6,740,246
- Issue date May 25, 2004
- Visteon Global Tech., Inc.
- Andrew Zachary Glovatsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit board and method of making same
- Patent number 6,555,015
- Issue date Apr 29, 2003
- Visteon Global Technologies, Inc.
- Daniel Phillip Dailey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit board and method of making same
- Patent number 6,528,736
- Issue date Mar 4, 2003
- Visteon Global Technologies, Inc.
- Daniel Phillip Dailey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solderless flip-chip assembly and method and material for same
- Patent number 6,326,241
- Issue date Dec 4, 2001
- Visteon Global Technologies, Inc.
- Robert Edward Belke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of laminating a flexible circuit to a substrate
- Patent number 6,197,145
- Issue date Mar 6, 2001
- Ford Motor Company
- Michael George Todd
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Three-dimensional electronic circuit with multiple conductor layers...
- Patent number 6,100,178
- Issue date Aug 8, 2000
- Ford Motor Company
- Michael George Todd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated lighting assembly
- Patent number 6,076,950
- Issue date Jun 20, 2000
- Ford Global Technologies, Inc.
- Mark Stephen Topping
- F21 - LIGHTING
Information Patent Grant
Three-dimensional molded sockets for mechanical and electrical comp...
- Patent number 5,994,648
- Issue date Nov 30, 1999
- Ford Motor Company
- Andrew Z. Glovatsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for cooling electronic components
- Patent number 5,986,884
- Issue date Nov 16, 1999
- Ford Motor Company
- Vivek Amir Jairazbhoy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional molded circuit board having interlocking connections
- Patent number 5,938,455
- Issue date Aug 17, 1999
- Ford Motor Company
- Andrew Zachary Glovatsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI protection and CTE control of three-dimensional circuitized sub...
- Patent number 5,929,375
- Issue date Jul 27, 1999
- Ford Motor Company
- Andrew Zachary Glovatsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for reworking a multi-layer circuit board using a shape memo...
- Patent number 5,925,298
- Issue date Jul 20, 1999
- Ford Motor Company
- Bethany Joy Walles
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Three-dimensional multi-layer molded electronic device and method f...
- Patent number 5,914,534
- Issue date Jun 22, 1999
- Ford Motor Company
- Michael George Todd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for dispensing solder paste on a non-planar substrate using...
- Patent number 5,909,839
- Issue date Jun 8, 1999
- Ford Motor Company
- Robert Edward Belke
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method of making a three-dimensional part with buried conductors
- Patent number 5,909,012
- Issue date Jun 1, 1999
- Ford Motor Company
- Michael George Todd
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for adhering a metallization to a substrate
- Patent number 5,882,954
- Issue date Mar 16, 1999
- Ford Motor Company
- Ram Singh Raghava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of supporting an electrical circuit on an electrically insul...
- Patent number 5,878,487
- Issue date Mar 9, 1999
- Ford Motor Company
- Richard Keith McMillan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fully additive method of applying a circuit pattern to a three-dime...
- Patent number 5,837,609
- Issue date Nov 17, 1998
- Ford Motor Company
- Michael George Todd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Repairable flip-chip undercoating assembly and method and material...
- Patent number 5,783,867
- Issue date Jul 21, 1998
- Ford Motor Company
- Robert Edward Belke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit clip connector
- Patent number 5,752,851
- Issue date May 19, 1998
- Ford Motor Company
- Victor V. Zaderej
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional multi-layer circuit structure and method for form...
- Patent number 5,738,797
- Issue date Apr 14, 1998
- Ford Global Technologies, Inc.
- Robert E. Belke
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Overlay substrate for securing electronic devices in a vehicle
- Patent number 5,715,140
- Issue date Feb 3, 1998
- Ford Motor Company
- Peter Joseph Sinkunas
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Ventilation duct with integrated electronics enclosure
- Patent number 5,706,170
- Issue date Jan 6, 1998
- Ford Motor Company
- Andrew Zachary Glovatsky
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for embedding conductors in a structure
- Patent number 5,705,104
- Issue date Jan 6, 1998
- Ford Motor Company
- John Trublowski
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Enhanced plating adhesion through the use of metallized fillers in...
- Patent number 5,702,584
- Issue date Dec 30, 1997
- Ford Motor Company
- Lakhi N. Goenka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Forming rigid circuit board
- Patent number 5,655,291
- Issue date Aug 12, 1997
- Ford Motor Company
- Michael George Todd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit assembly with polymeric underfill body
- Patent number 5,654,081
- Issue date Aug 5, 1997
- Ford Motor Company
- Michael G. Todd
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Simultaneous process for surface mount adhesive cure and solder pas...
- Patent number 5,639,010
- Issue date Jun 17, 1997
- Ford Motor Company
- Michael G. Todd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BENZOXAZINE CONTAINING COMPOSITIONS OF MATTER AND CURABLE COMPOSITI...
- Publication number 20100140542
- Publication date Jun 10, 2010
- Henkel Corporation
- Qing Ji
- C07 - ORGANIC CHEMISTRY
Information Patent Application
Electronic Packaging Materials for Use with Low-K Dielectric-Contai...
- Publication number 20080122088
- Publication date May 29, 2008
- Michael G. Todd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Epoxy-Based Compositions Having Improved Impact Resistance
- Publication number 20080051524
- Publication date Feb 28, 2008
- Henkel Corporation
- Qing Ji
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Methods For Improving The Flux Compatibility Of Underfill Formulations
- Publication number 20070261883
- Publication date Nov 15, 2007
- Bruce C.B. Chan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Organic acid containing compositions and methods for use thereof
- Publication number 20040086719
- Publication date May 6, 2004
- HENKEL LOCTITE CORPORATION
- Bruce C. B. Chan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Circuit board and a method for making the same
- Publication number 20020148642
- Publication date Oct 17, 2002
- Andrew Zachary Glovatsky
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Michael G. Todd

Person

Patents Grantslast 30 patents

Electronic packaging materials for use with low-k dielectric-contai...

Organic acid containing compositions and methods for use thereof

Circuit board and a method for making the same

Multi-layer printed circuit board and method of making same

Multi-layer printed circuit board and method of making same

Solderless flip-chip assembly and method and material for same

Method of laminating a flexible circuit to a substrate

Three-dimensional electronic circuit with multiple conductor layers...

Integrated lighting assembly

Three-dimensional molded sockets for mechanical and electrical comp...

Method for cooling electronic components

Three-dimensional molded circuit board having interlocking connections

EMI protection and CTE control of three-dimensional circuitized sub...

Method for reworking a multi-layer circuit board using a shape memo...

Three-dimensional multi-layer molded electronic device and method f...

Method for dispensing solder paste on a non-planar substrate using...

Method of making a three-dimensional part with buried conductors

Method for adhering a metallization to a substrate

Method of supporting an electrical circuit on an electrically insul...

Fully additive method of applying a circuit pattern to a three-dime...

Repairable flip-chip undercoating assembly and method and material...

Circuit clip connector

Three-dimensional multi-layer circuit structure and method for form...

Overlay substrate for securing electronic devices in a vehicle

Ventilation duct with integrated electronics enclosure

Method for embedding conductors in a structure

Enhanced plating adhesion through the use of metallized fillers in...

Forming rigid circuit board

Integrated circuit assembly with polymeric underfill body

Simultaneous process for surface mount adhesive cure and solder pas...

Patents Applicationslast 30 patents

BENZOXAZINE CONTAINING COMPOSITIONS OF MATTER AND CURABLE COMPOSITI...

Electronic Packaging Materials for Use with Low-K Dielectric-Contai...

Epoxy-Based Compositions Having Improved Impact Resistance

Methods For Improving The Flux Compatibility Of Underfill Formulations

Organic acid containing compositions and methods for use thereof

Circuit board and a method for making the same