Michael Goroll

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Poing, DE

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with interlocked connection
- Patent number 10,090,216
- Issue date Oct 2, 2018
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with interlocked connection
- Patent number 9,627,305
- Issue date Apr 18, 2017
- Infineon Technologies AG
- Georg Meyer-Berg
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
CHIP WITH CRACK GUIDING STRUCTURE COMBINED WITH CRACK STOP STRUCTURE
- Publication number 20240145408
- Publication date May 2, 2024
- INFINEON TECHNOLOGIES AG
- Maria HEIDENBLUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING A CRACK STOP STRUCTURE
- Publication number 20220270985
- Publication date Aug 25, 2022
- Sergey Ananiev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package With Interlocked Connection
- Publication number 20170170082
- Publication date Jun 15, 2017
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE WITH INTERLOCKED CONNECTION
- Publication number 20150014845
- Publication date Jan 15, 2015
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- G06 - COMPUTING CALCULATING COUNTING