Michael Han

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San Diego, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Non-circular under bump metallization (UBM) structure, orientation...
- Patent number 8,847,391
- Issue date Sep 30, 2014
- QUALCOMM Incorporated
- Zhongping Bao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE INTERCONNECT INCLUDING AN INORGANIC COLLAR
- Publication number 20140124877
- Publication date May 8, 2014
- QUALCOMM Incorporated
- Yangyang Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NON-CIRCULAR UNDER BUMP METALLIZATION (UBM) STRUCTURE, ORIENTATION...
- Publication number 20140008788
- Publication date Jan 9, 2014
- QUALCOMM Incorporated
- Zhongping Bao
- H01 - BASIC ELECTRIC ELEMENTS