Michael Hsing

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Sanchong City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Support with recessed electrically conductive chip attachment mater...
- Patent number 7,635,869
- Issue date Dec 22, 2009
- Lumination LLC
- Boris Kolodin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Support for flip-chip bonding a light emitting chip
- Publication number 20080067537
- Publication date Mar 20, 2008
- GELCORE LLC
- Boris Kolodin
- H01 - BASIC ELECTRIC ELEMENTS