Michael Huettinger

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Munich, DE

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Patents Grantslast 30 patents

Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrical contact and method of forming a chi...
- Patent number 10,978,418
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a chip package with compounds to improve the dur...
- Patent number 10,672,678
- Issue date Jun 2, 2020
- Infineon Technologies AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package comprising a chemical compound and a method of forming...
- Patent number 10,497,634
- Issue date Dec 3, 2019
- Infineon Technologies AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package with a metal cont...
- Patent number 10,461,056
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package
- Patent number 9,941,181
- Issue date Apr 10, 2018
- Infineon Technologies AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20210082861
- Publication date Mar 18, 2021
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE WITH A METAL CONT...
- Publication number 20200013749
- Publication date Jan 9, 2020
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING A CHIP PACKAGE
- Publication number 20190287875
- Publication date Sep 19, 2019
- INFINEON TECHNOLOGIES AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20170338165
- Publication date Nov 23, 2017
- INFINEON TECHNOLOGIES AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20170338169
- Publication date Nov 23, 2017
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20170338164
- Publication date Nov 23, 2017
- INFINEON TECHNOLOGIES AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS