Michael J. Anderson

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Campbell, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated device package
- Patent number 11,189,593
- Issue date Nov 30, 2021
- Analog Devices International Unlimited Company
- Teik Tiong Toong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked circuit package with molded base having laser drilled openi...
- Patent number 10,497,635
- Issue date Dec 3, 2019
- Linear Technology Holding LLC
- John D. Brazzle
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED DEVICE PACKAGE WITH AN INTEGRATED HEAT SINK
- Publication number 20230142729
- Publication date May 11, 2023
- Analog Devices, Inc.
- Michael John Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20210134510
- Publication date May 6, 2021
- Analog Devices International Unlimited Company
- Michael John Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE PACKAGE
- Publication number 20210082862
- Publication date Mar 18, 2021
- Analog Devices International Unlimited Company
- Teik Tiong Toong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CIRCUIT PACKAGE WITH MOLDED BASE HAVING LASER DRILLED OPENI...
- Publication number 20190304865
- Publication date Oct 3, 2019
- Linear Technology Holding LLC
- John D. Brazzle
- H01 - BASIC ELECTRIC ELEMENTS