Michael J. Baker

Person

DuPont, WA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Carrier for microelectronic assemblies having direct bonding
- Patent number 12,142,510
- Issue date Nov 12, 2024
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Space-efficient underfilling techniques for electronic assemblies
- Patent number 9,728,425
- Issue date Aug 8, 2017
- Intel Corporation
- Joshua D. Heppner
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Pin grid array socket
- Patent number 6,347,946
- Issue date Feb 19, 2002
- Intel Corporation
- Mark B. Trobough
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING
- Publication number 20230317676
- Publication date Oct 5, 2023
- Intel Corporation
- Michael Baker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURES WITH COLLAPSE CONTROL FEATURES
- Publication number 20230317630
- Publication date Oct 5, 2023
- Intel Corporation
- Wenhao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-PLANAR PEDESTAL FOR THERMAL COMPRESSION BONDING
- Publication number 20230317675
- Publication date Oct 5, 2023
- Intel Corporation
- Michael Baker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES WITH NON-UNIFORM INTERCONNECT FEATURES
- Publication number 20230317660
- Publication date Oct 5, 2023
- Intel Corporation
- Zhaozhi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER
- Publication number 20230317545
- Publication date Oct 5, 2023
- Intel Corporation
- Pilin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER FOR MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING
- Publication number 20220199450
- Publication date Jun 23, 2022
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER FOR MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING
- Publication number 20220199449
- Publication date Jun 23, 2022
- Intel Corporation
- Michael J. Baker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER FOR MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING
- Publication number 20220199453
- Publication date Jun 23, 2022
- Intel Corporation
- Michael J. Baker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT
- Publication number 20210375719
- Publication date Dec 2, 2021
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT
- Publication number 20190214328
- Publication date Jul 11, 2019
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACE-EFFICIENT UNDERFILLING TECHNIQUES FOR ELECTRONIC ASSEMBLIES
- Publication number 20180061673
- Publication date Mar 1, 2018
- Intel Corporation
- JOSHUA D. HEPPNER
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Michael J. Baker

Person

Patents Grantslast 30 patents

Carrier for microelectronic assemblies having direct bonding

Space-efficient underfilling techniques for electronic assemblies

Pin grid array socket

Patents Applicationslast 30 patents

BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING

PACKAGE STRUCTURES WITH COLLAPSE CONTROL FEATURES

NON-PLANAR PEDESTAL FOR THERMAL COMPRESSION BONDING

PACKAGE STRUCTURES WITH NON-UNIFORM INTERCONNECT FEATURES

PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER

CARRIER FOR MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING

CARRIER FOR MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING

CARRIER FOR MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING

STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT

STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT

SPACE-EFFICIENT UNDERFILLING TECHNIQUES FOR ELECTRONIC ASSEMBLIES