Michael J. Bertram

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
High force compression flip chip bonding system
- Patent number 5,462,217
- Issue date Oct 31, 1995
- Microelectronics and Computer Technology Corporation
- Richard L. Simmons
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High force compression flip chip bonding method and system
- Patent number 5,368,217
- Issue date Nov 29, 1994
- Microelectronics and Computer Technology Corporation
- Richard L. Simmons
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for forming metal leads
- Patent number 5,283,946
- Issue date Feb 8, 1994
- Microelectronics and Computer Technology Corporation
- Richard L. Simmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for the excise and lead form of TAB devices
- Patent number 5,210,936
- Issue date May 18, 1993
- Microelectronics and Computer Technology Corporation
- Richard L. Simmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for using desoldering material
- Patent number 5,072,874
- Issue date Dec 17, 1991
- Microelectronics and Computer Technology Corporation
- Michael J. Bertram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for aligning mating form tools
- Patent number 4,945,954
- Issue date Aug 7, 1990
- Microelectronics and Computer Technology Corporation
- James D. Wehrly
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Method and apparatus for removing solder mounted electronic components
- Patent number 4,934,582
- Issue date Jun 19, 1990
- Microelectronics and Computer Technology Corporation
- Michael J. Bertram
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Michael J. Bertram

Person

Patents Grantslast 30 patents

High force compression flip chip bonding system

High force compression flip chip bonding method and system

Method and apparatus for forming metal leads

Method and apparatus for the excise and lead form of TAB devices

Method and apparatus for using desoldering material

Method and apparatus for aligning mating form tools

Method and apparatus for removing solder mounted electronic components