Michael J. Bettinger

Person

Eagle, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Concave face wire bond capillary and method
- Patent number 7,677,429
- Issue date Mar 16, 2010
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concave face wire bond capillary and method
- Patent number 7,416,107
- Issue date Aug 26, 2008
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concave face wire bond capillary and method
- Patent number 6,966,480
- Issue date Nov 22, 2005
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for facilitating circuit board processing
- Patent number 6,655,535
- Issue date Dec 2, 2003
- Micron Technology, Inc.
- James M. Wark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concave face wire bond capillary and method
- Patent number 6,595,406
- Issue date Jul 22, 2003
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for providing mechanically pre-formed conducti...
- Patent number 6,509,205
- Issue date Jan 21, 2003
- Micron Technology, Inc.
- Ronald W. Ellis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for providing mechanically pre-formed conducti...
- Patent number 6,504,257
- Issue date Jan 7, 2003
- Micron Technology, Inc.
- Ronald W. Ellis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for forming wire bonds from circuitry on a substrate to a...
- Patent number 6,474,532
- Issue date Nov 5, 2002
- Micron Technology, Inc.
- Michael Bettinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatuses for forming wire bonds from circuitry on a substrate to...
- Patent number 6,454,153
- Issue date Sep 24, 2002
- Micron Technology, Inc.
- Michael Bettinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concave face wire bond capillary
- Patent number 6,439,450
- Issue date Aug 27, 2002
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for facilitating circuit board processing
- Patent number 6,398,043
- Issue date Jun 4, 2002
- Micron Technology, Inc.
- James M. Wark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for providing mechanically pre-formed conducti...
- Patent number 6,357,275
- Issue date Mar 19, 2002
- Micron Technology, Inc.
- Ronald W. Ellis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concave face wire bond capillary
- Patent number 6,311,890
- Issue date Nov 6, 2001
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for facilitating circuit board processing
- Patent number 6,279,758
- Issue date Aug 28, 2001
- Micron Technology, Inc.
- James M. Wark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for providing mechanically pre-formed conducti...
- Patent number 6,221,748
- Issue date Apr 24, 2001
- Micron Technology, Inc.
- Ronald W. Ellis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses for forming wire bonds from circuitry on a substrate to...
- Patent number 6,199,743
- Issue date Mar 13, 2001
- Micron Technology, Inc.
- Michael Bettinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for facilitating circuit board processing
- Patent number 6,158,595
- Issue date Dec 12, 2000
- Micron Technology, Inc.
- James M. Wark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concave face wire bond capillary
- Patent number 6,158,647
- Issue date Dec 12, 2000
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for facilitating circuit board processing
- Patent number 5,992,649
- Issue date Nov 30, 1999
- Micron Technology, Inc.
- James M. Wark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for facilitating circuit board processing
- Patent number 5,988,619
- Issue date Nov 23, 1999
- Micron Technology, Inc.
- James M. Wark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for facilitating circuit board processing
- Patent number 5,911,329
- Issue date Jun 15, 1999
- Micron Technology, Inc.
- James M. Wark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Actuator assembly
- Patent number 5,831,504
- Issue date Nov 3, 1998
- Micron Technology, Inc.
- John G. Piper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanical vision system using selective wavelength and brightness...
- Patent number 5,758,942
- Issue date Jun 2, 1998
- Micron Technology, Inc.
- Rich Fogal
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Actuator assembly
- Patent number 5,644,279
- Issue date Jul 1, 1997
- Micron Technology, Inc.
- John G. Piper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-contact, electrostatic, discharge detector
- Patent number 5,315,255
- Issue date May 24, 1994
- Micron Technology, Inc.
- Michael J. Bettinger
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
CONCAVE FACE WIRE BOND CAPILLARY AND METHOD
- Publication number 20080302862
- Publication date Dec 11, 2008
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Concave face wire bond capillary and method
- Publication number 20060032888
- Publication date Feb 16, 2006
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Concave face wire bond capillary and method
- Publication number 20040056072
- Publication date Mar 25, 2004
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Concave face wire bond capillary
- Publication number 20020134819
- Publication date Sep 26, 2002
- Gregory M. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for facilitating circuit board processing
- Publication number 20020124396
- Publication date Sep 12, 2002
- James M. Wark
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Concave face wire bond capillary
- Publication number 20020023943
- Publication date Feb 28, 2002
- Gregory M. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatuses for forming wire bonds from circuitry on a substrate to...
- Publication number 20010035451
- Publication date Nov 1, 2001
- Michael Bettinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for providing mechanically pre-formed conducti...
- Publication number 20010010944
- Publication date Aug 2, 2001
- Ronald W. Ellis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatuses for forming wire bonds from circuitry on a substrate to...
- Publication number 20010008247
- Publication date Jul 19, 2001
- Michael Bettinger
- H01 - BASIC ELECTRIC ELEMENTS

Michael J. Bettinger

Person

Patents Grantslast 30 patents

Concave face wire bond capillary and method

Concave face wire bond capillary and method

Concave face wire bond capillary and method

Methods for facilitating circuit board processing

Concave face wire bond capillary and method

Apparatus and method for providing mechanically pre-formed conducti...

Apparatus and method for providing mechanically pre-formed conducti...

Apparatus for forming wire bonds from circuitry on a substrate to a...

Apparatuses for forming wire bonds from circuitry on a substrate to...

Concave face wire bond capillary

Apparatus and method for facilitating circuit board processing

Apparatus and method for providing mechanically pre-formed conducti...

Concave face wire bond capillary

Apparatus and method for facilitating circuit board processing

Apparatus and method for providing mechanically pre-formed conducti...

Apparatuses for forming wire bonds from circuitry on a substrate to...

Apparatus and method for facilitating circuit board processing

Concave face wire bond capillary

Apparatus and method for facilitating circuit board processing

Apparatus and method for facilitating circuit board processing

Apparatus and method for facilitating circuit board processing

Actuator assembly

Mechanical vision system using selective wavelength and brightness...

Actuator assembly

Non-contact, electrostatic, discharge detector

Patents Applicationslast 30 patents

CONCAVE FACE WIRE BOND CAPILLARY AND METHOD

Concave face wire bond capillary and method

Concave face wire bond capillary and method

Concave face wire bond capillary

Apparatus and method for facilitating circuit board processing

Concave face wire bond capillary

Apparatuses for forming wire bonds from circuitry on a substrate to...

Apparatus and method for providing mechanically pre-formed conducti...

Apparatuses for forming wire bonds from circuitry on a substrate to...