Michael J. Boehm

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Warren, OH, US

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Patents Grantslast 30 patents

Information Patent Grant
Temperature sensor with flexible circuit substrate
- Patent number 6,588,931
- Issue date Jul 8, 2003
- Delphi Technologies, Inc.
- Timothy M. Betzner
- G01 - MEASURING TESTING
Information Patent Grant
Thermal probe assembly with mold-over crimp sensor packaging
- Patent number 5,749,656
- Issue date May 12, 1998
- General Motors Corporation
- Michael James Boehm
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Temperature sensor with flexible circuit substrate
- Publication number 20020071475
- Publication date Jun 13, 2002
- Timothy M. Betzner
- G01 - MEASURING TESTING