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Michael J. Bohlinger

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  • Minetonka, MN, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Vertical sensor assembly method
    • Patent number 8,703,543
    • Issue date Apr 22, 2014
    • Honeywell International Inc.
    • Hong Wan
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Low height vertical sensor packaging
    • Patent number 7,671,478
    • Issue date Mar 2, 2010
    • Honeywell International Inc.
    • Lakshman S. Wathanawasam
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Single package design for 3-axis magnetic sensor
    • Patent number 7,271,586
    • Issue date Sep 18, 2007
    • Honeywell International Inc.
    • Michael J. Bohlinger
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Magnetic field sensing device
    • Patent number 7,202,771
    • Issue date Apr 10, 2007
    • Honeywell International, Inc.
    • Michael J. Bohlinger
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Vertical die chip-on-board
    • Patent number 7,095,226
    • Issue date Aug 22, 2006
    • Honeywell International, Inc.
    • Hong Wan
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Magnetic field sensing device
    • Patent number 7,034,651
    • Issue date Apr 25, 2006
    • Honeywell International Inc.
    • Michael J. Bohlinger
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Magnetic field sensing device
    • Patent number 6,529,114
    • Issue date Mar 4, 2003
    • Honeywell International Inc.
    • Michael J. Bohlinger
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Magnetometer package
    • Patent number 6,504,366
    • Issue date Jan 7, 2003
    • Honeywell International Inc.
    • Joel J. Bodin
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Method of fabricating a magnetoresistive sensor
    • Patent number 5,820,924
    • Issue date Oct 13, 1998
    • Honeywell Inc.
    • William F. Witcraft
    • B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

  • Information Patent Application

    VERTICAL SENSOR ASSEMBLY METHOD
    • Publication number 20110012213
    • Publication date Jan 20, 2011
    • Honeywell International Inc.
    • Hong Wan
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    3D INTEGRATED COMPASS PACKAGE
    • Publication number 20090072823
    • Publication date Mar 19, 2009
    • Honeywell International Inc.
    • Hong Wan
    • G01 - MEASURING TESTING
  • Information Patent Application

    Low height vertical sensor packaging
    • Publication number 20070052077
    • Publication date Mar 8, 2007
    • Honeywell International Inc.
    • Lakshman S. Wathanawasam
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Magnetic field sensing device
    • Publication number 20060152332
    • Publication date Jul 13, 2006
    • Honeywell International Inc.
    • Michael J. Bohlinger
    • G01 - MEASURING TESTING
  • Information Patent Application

    Vertical die chip-on-board
    • Publication number 20050122100
    • Publication date Jun 9, 2005
    • Honeywell International Inc.
    • Hong Wan
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Single package design for 3-axis magnetic sensor
    • Publication number 20050122101
    • Publication date Jun 9, 2005
    • Honeywell International Inc.
    • Michael J. Bohlinger
    • G01 - MEASURING TESTING
  • Information Patent Application

    Magnetic field sensing device
    • Publication number 20030141957
    • Publication date Jul 31, 2003
    • Michael J. Bohlinger
    • G01 - MEASURING TESTING
  • Information Patent Application

    MAGNETOMETER PACKAGE
    • Publication number 20020140422
    • Publication date Oct 3, 2002
    • Joel J. Bodin
    • G01 - MEASURING TESTING