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Michael J. Costello
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Chandler, AZ, US
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last 30 patents
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Patent Grant
Process for assembling an integrated circuit package having a subst...
Patent number
RE44629
Issue date
Dec 10, 2013
Intel Corporation
Suresh Ramalingam
029 - Metal working
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Patent Grant
Integrated circuit package having a substrate vent hole
Patent number
6,490,166
Issue date
Dec 3, 2002
Intel Corporation
Suresh Ramalingam
H01 - BASIC ELECTRIC ELEMENTS