Michael J. Hundt

Person

Lewisville, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package including embedded thin-film battery
- Patent number 9,012,264
- Issue date Apr 21, 2015
- STMicroelectronics, Inc.
- Michael J. Hundt
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit package including embedded thin-film battery
- Patent number 8,766,435
- Issue date Jul 1, 2014
- STMicroelectronics, Inc.
- Michael J. Hundt
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of packaging integrated circuits
- Patent number 8,163,220
- Issue date Apr 24, 2012
- STMicroelectronics, Inc.
- Michael J. Hundt
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Molded integrated circuit package with exposed active area
- Patent number 7,402,454
- Issue date Jul 22, 2008
- STMicroelectronics, Inc.
- Tiao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally-enhanced ball grid array package structure and method
- Patent number 7,315,079
- Issue date Jan 1, 2008
- STMicroelectronics, Inc.
- Tiao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded integrated circuit package with exposed active area
- Patent number 7,304,362
- Issue date Dec 4, 2007
- STMicroelectronics, Inc.
- Tiao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for attaching an integrating circuit sensor to...
- Patent number 7,244,967
- Issue date Jul 17, 2007
- STMicroelectronics, Inc.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally-enhanced ball grid array package structure and method
- Patent number 7,180,175
- Issue date Feb 20, 2007
- STMicroelectronics, Inc.
- Tiao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BGA memory module with battery pack
- Patent number 6,846,186
- Issue date Jan 25, 2005
- STMicroelectronics, Inc.
- Tom Lao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold with compensating base
- Patent number 6,817,854
- Issue date Nov 16, 2004
- STMicroelectronics, Inc.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for attaching an integrated circuit sensor to...
- Patent number 6,815,262
- Issue date Nov 9, 2004
- STMicroelectronics, Inc.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for exposed die molding for integrated circuit pa...
- Patent number 6,686,227
- Issue date Feb 3, 2004
- STMicroelectronics, Inc.
- Tiao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-frame forming for improved thermal performance
- Patent number 6,586,821
- Issue date Jul 1, 2003
- STMicroelectronics, Inc.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around interconnect for fine pitch ball grid array
- Patent number 6,372,543
- Issue date Apr 16, 2002
- STMicroelectronics, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around interconnect for fine pitch ball grid array
- Patent number 6,121,678
- Issue date Sep 19, 2000
- STMicroelectronics, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-profile socketed packaging system with land-grid array and ther...
- Patent number 6,113,399
- Issue date Sep 5, 2000
- STMicroelectronics, Inc.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging for silicon sensors
- Patent number 6,028,773
- Issue date Feb 22, 2000
- STMicroelectronics, Inc.
- Michael J. Hundt
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Surface mountable integrated circuit package with detachable module...
- Patent number 5,994,774
- Issue date Nov 30, 1999
- STMicroelectronics, Inc.
- Harry Michael Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array integrated circuit package with high thermal conduc...
- Patent number 5,991,156
- Issue date Nov 23, 1999
- STMicroelectronics, Inc.
- Robert H. Bond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-profile socketed packaging system with land-grid array and ther...
- Patent number 5,805,419
- Issue date Sep 8, 1998
- STMicroelectronics, Inc.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an integrated circuit package with flat-topped hea...
- Patent number 5,711,069
- Issue date Jan 27, 1998
- SGS-Thomson Microelectronics, Inc.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array integrated circuit package with high thermal conduc...
- Patent number 5,693,572
- Issue date Dec 2, 1997
- SGS-Thomson Microelectronics, Inc.
- Robert H. Bond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-profile socketed packaging system with land-grid array and ther...
- Patent number 5,677,247
- Issue date Oct 14, 1997
- SGS-Thomson Microelectronics, Inc.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball-grid-array integrated circuit package with solder-connected th...
- Patent number 5,642,261
- Issue date Jun 24, 1997
- SGS-Thomson Microelectronics, Inc.
- Robert H. Bond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate mounting of circuit components with a low profile
- Patent number 5,610,800
- Issue date Mar 11, 1997
- SGS-Thomson Microelectronics, Inc.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for dissipating heat from a semiconductor package
- Patent number 5,590,462
- Issue date Jan 7, 1997
- SGS-Thomson Microelectronics S.r.l.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mountable integrated circuit package with low-profile detac...
- Patent number 5,570,273
- Issue date Oct 29, 1996
- SGS-Thomson Microelectronics, Inc.
- Harry M. Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mountable integrated circuit package with detachable module
- Patent number 5,557,504
- Issue date Sep 17, 1996
- SGS-Thomson Microelectronics, Inc.
- Harry M. Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mountable integrated circuit package with integrated batter...
- Patent number 5,498,903
- Issue date Mar 12, 1996
- SGS-Thomson Microelectronics, Inc.
- D. Craig Dixon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for achieving printed circuit board planarity
- Patent number 5,491,889
- Issue date Feb 20, 1996
- SGS-Thomson Microelectronics, Inc.
- Michael J. Hundt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE INCLUDING EMBEDDED THIN-FILM BATTERY
- Publication number 20140315334
- Publication date Oct 23, 2014
- Michael J. Hundt
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Application
BALL GRID ARRAY PACKAGE
- Publication number 20100019374
- Publication date Jan 28, 2010
- STMicroelectronics, Inc.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM BATTERY EQUIPMENT
- Publication number 20090278503
- Publication date Nov 12, 2009
- STMicroelectronics, Inc.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mold with compensating base
- Publication number 20080290557
- Publication date Nov 27, 2008
- STMicroelectronics, Inc.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally-enhanced ball grid array package structure and method
- Publication number 20070200224
- Publication date Aug 30, 2007
- STMicroelectronics, Inc.
- Tiao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded integrated circuit package with exposed active area
- Publication number 20070085222
- Publication date Apr 19, 2007
- STMicroelectronics, Inc.
- Tiao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package including embedded thin-film battery
- Publication number 20060001137
- Publication date Jan 5, 2006
- STMicroelectronics, Inc.
- Michael J. Hundt
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Application
Mold with compensating base
- Publication number 20050082718
- Publication date Apr 21, 2005
- STMicroelectronics, Inc.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for attaching an integrated circuit sensor to...
- Publication number 20040241905
- Publication date Dec 2, 2004
- STMicroelectronics, Inc.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin-film battery equipment
- Publication number 20040081860
- Publication date Apr 29, 2004
- STMicroelectronics, Inc.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for attaching an integrated circuit sensor to...
- Publication number 20040012084
- Publication date Jan 22, 2004
- STMicroelectronics, Inc.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mold with compensating base
- Publication number 20030214074
- Publication date Nov 20, 2003
- STMicroelectronics, Inc.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded integrated circuit package with exposed active area
- Publication number 20030214021
- Publication date Nov 20, 2003
- STMicroelectronics, Inc.
- Tiao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BGA memory module with self-contained battery pack
- Publication number 20030201751
- Publication date Oct 30, 2003
- STMicroelectronics, Inc.
- Tom Lao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-frame forming for improved thermal performance
- Publication number 20030151120
- Publication date Aug 14, 2003
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally-enhanced ball grid array package structure and method
- Publication number 20030146507
- Publication date Aug 7, 2003
- STMicroelectronics, Inc.
- Tiao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for exposed die molding for integrated circuit pa...
- Publication number 20030148556
- Publication date Aug 7, 2003
- STMicroelectronics, Inc.
- Tiao Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Michael J. Hundt

Person

Patents Grantslast 30 patents

Integrated circuit package including embedded thin-film battery

Integrated circuit package including embedded thin-film battery

Method of packaging integrated circuits

Molded integrated circuit package with exposed active area

Thermally-enhanced ball grid array package structure and method

Molded integrated circuit package with exposed active area

Apparatus and method for attaching an integrating circuit sensor to...

Thermally-enhanced ball grid array package structure and method

BGA memory module with battery pack

Mold with compensating base

Apparatus and method for attaching an integrated circuit sensor to...

Method and system for exposed die molding for integrated circuit pa...

Lead-frame forming for improved thermal performance

Wrap-around interconnect for fine pitch ball grid array

Wrap-around interconnect for fine pitch ball grid array

Low-profile socketed packaging system with land-grid array and ther...

Packaging for silicon sensors

Surface mountable integrated circuit package with detachable module...

Ball grid array integrated circuit package with high thermal conduc...

Low-profile socketed packaging system with land-grid array and ther...

Method of making an integrated circuit package with flat-topped hea...

Ball grid array integrated circuit package with high thermal conduc...

Low-profile socketed packaging system with land-grid array and ther...

Ball-grid-array integrated circuit package with solder-connected th...

Substrate mounting of circuit components with a low profile

Process for dissipating heat from a semiconductor package

Surface mountable integrated circuit package with low-profile detac...

Surface mountable integrated circuit package with detachable module

Surface mountable integrated circuit package with integrated batter...

Apparatus for achieving printed circuit board planarity

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE INCLUDING EMBEDDED THIN-FILM BATTERY

BALL GRID ARRAY PACKAGE

THIN-FILM BATTERY EQUIPMENT

Mold with compensating base

Thermally-enhanced ball grid array package structure and method

Molded integrated circuit package with exposed active area

Integrated circuit package including embedded thin-film battery

Mold with compensating base

Apparatus and method for attaching an integrated circuit sensor to...

Thin-film battery equipment

Apparatus and method for attaching an integrated circuit sensor to...

Mold with compensating base

Molded integrated circuit package with exposed active area

BGA memory module with self-contained battery pack

Lead-frame forming for improved thermal performance

Thermally-enhanced ball grid array package structure and method

Method and system for exposed die molding for integrated circuit pa...