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Michael J. Lugert
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Manlius, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method of manufacturing printed circuit board assemblies with engin...
Patent number
11,711,885
Issue date
Jul 25, 2023
TTM Technologies, Inc.
Rick Bauer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods for fabricating printed circuit board assemblies with high...
Patent number
10,980,127
Issue date
Apr 13, 2021
TTM Technologies Inc.
Michael Len
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Coupler device
Patent number
8,044,749
Issue date
Oct 25, 2011
Anaren, Inc.
Tomasz M. Witas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Surface mount stripline devices having ceramic and soft board hybri...
Patent number
7,728,694
Issue date
Jun 1, 2010
Anaren, Inc.
Bo Jensen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PRINTED CIRCUIT BOARD ASSEMBLIES WITH ENGINEERED THERMAL PATHS AND...
Publication number
20210243880
Publication date
Aug 5, 2021
Anaren, Inc.
Rick Bauer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHODS FOR FABRICATING PRINTED CIRCUIT BOARD ASSEMBLIES WITH HIGH...
Publication number
20210227695
Publication date
Jul 22, 2021
Michael LEN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHODS FOR FABRICATING PRINTED CIRCUIT BOARD ASSEMBLIES WITH HIGH...
Publication number
20200288576
Publication date
Sep 10, 2020
TTM TECHNOLOGIES, INC.
Michael LEN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
High Power Hybrid Material Surface Mount Stripline Devices
Publication number
20090027143
Publication date
Jan 29, 2009
ANAREN, INC.
Bo Jensen
H01 - BASIC ELECTRIC ELEMENTS